Assignee
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG
AT·183 granted patents·85 pending applications·219 citations·filing 2012–2025
Top patents by PatentIndex Score
268 records- 0194US10440835B1Forming through holes through exposed dielectric material of component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Oct 8, 2019·14 cites·18 claims
- 0293US12112888B2Component carrier with cavity accommodating at least part of driven body being magnetically drivable to moveAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Granted Oct 8, 2024·2 cites·13 claims
- 0393US11889622B2Electronic device with connected component carrier and fluid cooling memberAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Granted Jan 30, 2024·2 cites·20 claims
- 0493US10531577B1Forming through holes through exposed dielectric material of component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Jan 7, 2020·11 cites·20 claims
- 0591US10665526B2Component carrier comprising at least one heat pipe and method for producing said component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2017·Granted May 26, 2020·8 cites·12 claims
- 0691US9418930B2Power moduleAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2014·Granted Aug 16, 2016·14 cites·9 claims
- 0789US11510316B2Overhang-compensating annular plating layer in through hole of component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Granted Nov 22, 2022·2 cites·24 claims
- 0889US11450587B2Heat removal mechanism for stack-based electronic device with process control component and processing componentsAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Granted Sep 20, 2022·2 cites·15 claims
- 0989US10998672B2Component carrier structures connected by cooperating magnet structuresAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted May 4, 2021·6 cites·12 claims
- 1089US10617012B2Methods of manufacturing flexible printed circuit boardsAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2017·Granted Apr 7, 2020·5 cites·16 claims
- 1189US9781845B2Semi-finished product for the production of a printed circuit board and method for producing the sameAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2014·Granted Oct 3, 2017·9 cites·7 claims
- 1288US11044812B2Component carrier with adhesion promoting shape of wiring structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Jun 22, 2021·6 cites·13 claims
- 1388US10779413B2Method of embedding a component in a printed circuit boardAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2014·Granted Sep 15, 2020·8 cites·13 claims
- 1486US11445612B2Component carrier with a dielectric element placed in a cavity and a manufacturing methodAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Granted Sep 13, 2022·2 cites·19 claims
- 1586US11322482B2Component carrier with opposed stacks having respective connection bodies and a method for manufacturing the component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted May 3, 2022·2 cites·15 claims
- 1685US12167529B2Heat removal architecture for stack-type component carrier with embedded componentAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Granted Dec 10, 2024·1 cites·18 claims
- 1785US11546990B2Component carrier with bridge structure in through hole fulfilling minimum distance design ruleAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Jan 3, 2023·2 cites·19 claims
- 1885US11051403B2Overhang-compensating annular plating layer in through hole of component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Jun 29, 2021·2 cites·25 claims
- 1984US11483927B2Component carrier with electrically reliable bridge with sufficiently thick vertical thickness in through hole of thin dielectricAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Granted Oct 25, 2022·2 cites·18 claims
- 2084US10219384B2Circuit board structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2014·Granted Feb 26, 2019·6 cites·9 claims
- 2184US10187997B2Method for making contact with a component embedded in a printed circuit boardAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2015·Granted Jan 22, 2019·5 cites·7 claims
- 2283US11574849B2Package with embedded electronic component being encapsulated in a pressureless wayAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Feb 7, 2023·8 cites·15 claims
- 2383US11439018B2Component carrier and method of manufacturing the sameAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Sep 6, 2022·2 cites·18 claims
- 2483US11398334B2Component carrier comprising embedded inductor with an inlayAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Jul 26, 2022·2 cites·13 claims
- 2583US10490887B2Printed circuit board product with antenna structure and method for its productionAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2017·Granted Nov 26, 2019·5 cites·22 claims
- 2683US9763337B2Semi-finished product for the production of a printed circuit board, method for producing a printed circuit board and printed circuit boardAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2013·Granted Sep 12, 2017·6 cites·3 claims
- 2782US10945332B2Heat capacitive component carrier and method to produce said component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2017·Granted Mar 9, 2021·4 cites·10 claims
- 2882US2026082487A1Inlay With Exposed Porous Layer, Component Carrier, and Manufacturing MethodAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2025·Application pending·0 cites
- 2981US12513825B2Component carrier with embedded component connected by galvanic connection stackAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2024·Granted Dec 30, 2025·0 cites·20 claims
- 3081US11864306B2Component carrier with an embedded thermally conductive block and manufacturing methodAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Granted Jan 2, 2024·1 cites·17 claims
- 3181US11784115B2Component carrier having dielectric layer with conductively filled through holes tapering in opposite directionsAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Granted Oct 10, 2023·2 cites·20 claims
- 3281US9713248B2Method for producing a circuit boardAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2015·Granted Jul 18, 2017·6 cites·17 claims
- 3381US2025349688A1Component Carrier With Photoimageable Dielectric Layer and Structured Conductive Layer Being Used as a Mask for Selectively Exposing the Photoimageable Dielectric Layer With Electromagnetic RadiationAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2025·Application pending·0 cites
- 3481US2026060117A1Component Carrier With Surface Mounted Components Connected By High Density Connection RegionAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2025·Application pending·0 cites
- 3580US11324122B2Component carrier and method of manufacturing the sameAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted May 3, 2022·1 cites·14 claims
- 3680US10966318B2Component carrier with electrically reliable bridge with sufficiently thick vertical thickness in through hole of thin dielectricAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Mar 30, 2021·2 cites·18 claims
- 3780US9698130B2Connection system for electronic componentsAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2016·Granted Jul 4, 2017·5 cites·12 claims
- 3879US11430703B2Aligning component carrier structure with known-good sections and critical section with other component carrier with components and dummiesAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Aug 30, 2022·1 cites·8 claims
- 3979US11211317B2Component carrier comprising a component having vertical through connectionAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Dec 28, 2021·1 cites·11 claims
- 4078US12400968B2Component with dielectric layer for embedding in component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Granted Aug 26, 2025·0 cites·16 claims
- 4178US10992055B2Component carrier with integrated antenna arrangement, electronic apparatus, radio communication methodAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2017·Granted Apr 27, 2021·3 cites·19 claims
- 4278US10887977B2Hybrid component carrier and method for manufacturing the sameAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Jan 5, 2021·2 cites·9 claims
- 4378US10716201B2Component carrier and method to produce said component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2017·Granted Jul 14, 2020·3 cites·15 claims
- 4477US11172576B2Method for producing a printed circuit board structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Nov 9, 2021·2 cites·11 claims
- 4577US11058009B2Component carrier comprising a photo-imageable dielectric and method of manufacturing the sameAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Jul 6, 2021·3 cites·27 claims
- 4677US10763423B2MEMS piezoelectric transducer formed at a PCB support structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2017·Granted Sep 1, 2020·3 cites·20 claims
- 4777US9648758B2Method for producing a circuit board and use of such a methodAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2013·Granted May 9, 2017·7 cites·16 claims
- 4876US11452199B2Electronic module with single or multiple components partially surrounded by a thermal decoupling gapAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Sep 20, 2022·2 cites·20 claims
- 4976US11069622B2Interposer-type component carrier and method of manufacturing the sameAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Jul 20, 2021·2 cites·24 claims
- 5076US9521743B2Printed circuit board with crosstalk reduction featuresAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2013·Granted Dec 13, 2016·4 cites·9 claims
Showing the top 50 of 268 patent records by PatentIndex Score.
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