Substrate treating apparatus

Abstract

The present invention provides a substrate treating apparatus. The substrate treating apparatus includes: a vessel providing a sealable treatment space; and a substrate supporting member positioned in the treatment space of the vessel and supporting a substrate, wherein the vessel includes: a through-hole formed through from an outer surface to an inner surface such that a process fluid is supplied to the treatment space; and a pipe connection assembly provided on an outer surface on which the through-hole is formed, and provided for connection with a process fluid supply pipe.

What is claimed is: 
     
         1 . A substrate treating apparatus comprising:
 a vessel providing a sealable treatment space; and   a substrate supporting member positioned in the treatment space of the vessel and supporting a substrate,   wherein the vessel comprises:   a through-hole formed through from an outer surface to an inner surface such that a process fluid is supplied to the treatment space; and   a pipe connection assembly provided on an outer surface on which the through-hole is formed, and provided for connection with a process fluid supply pipe.   
     
     
         2 . The substrate treating apparatus of  claim 1 , wherein the pipe connection assembly comprises:
 a protruding port through which the through-hole extends and that protrudes from the outer surface; and   a connection pipe connected to the protruding port by welding and having a joint for fitting with the process fluid supply pipe.   
     
     
         3 . The substrate treating apparatus of  claim 2 , wherein the pipe connection assembly further comprises:
 an expansion pipe provided between the protruding port and the connection pipe when diameters of the through-hole and the process fluid supply pipe are different; and   a protective cap provided to surround a weld between the protruding port and the expansion pipe and a weld between the expansion pipe and the connection pipe, and   the expansion pipe is connected to the protruding port and the connection pipe by welding.   
     
     
         4 . The substrate treating apparatus of  claim 3 , wherein the protective cap is provided to surround the joint. 
     
     
         5 . The substrate treating apparatus of  claim 3 , wherein the expansion pipe has a first end portion having a first inner diameter the same as an inner diameter of the protruding port, a second end portion having a second inner diameter the same as an inner diameter of the connection pipe, and a connecting portion connecting the first end portion and the second end portion;
 the inner diameter of the protruding port is the same as an inner diameter of the through-hole; and   the inner diameter of the connecting pipe is the same as an inner diameter of the process fluid supply pipe.   
     
     
         6 . The substrate treating apparatus of  claim 2 , wherein the through-hole has roughness the same as surface roughness of an inner surface of the process fluid supply pipe. 
     
     
         7 . The substrate treating apparatus of  claim 6 , wherein the through-hole is electro-polished. 
     
     
         8 . The substrate treating apparatus of  claim 5 , wherein the through-hole has an inner diameter larger than the inner diameter of the process fluid supply pipe. 
     
     
         9 . The substrate treating apparatus of  claim 2 , wherein the process fluid is a supercritical fluid. 
     
     
         10 . A substrate treating apparatus comprising:
 a vessel providing a sealable treatment space through a combination of an upper body and a lower body; and   a substrate supporting member positioned in the treatment space of the vessel and supporting a substrate,   wherein the upper body comprises a first through-hole formed through from an inner lower surface in contact with the treatment space to an outer upper surface, and a first pipe connection assembly provided on the outer upper surface for connection of the first through-hole and a first process fluid supply pipe; and   the lower body comprises a second through-hole formed through from an inner top surface being in contact with the treatment space to an outer lower surface, and a second pipe connection assembly provided on the outer lower surface for connection of the second through-hole and a second process fluid supply pipe.   
     
     
         11 . The substrate treating apparatus of  claim 10 , wherein the first pipe connection assembly comprises:
 a first protruding port through which the first through-hole extends and that protrudes from the outer upper surface; and   a first connection pipe connected to the first protruding port by welding and having a joint for fitting with the first process fluid supply pipe, and   the second pipe connection assembly comprises:   a second protruding port through which the second through-hole extends and that protrudes from the outer lower surface; and   a second connection pipe connected to the second protruding port by welding and having a joint for fitting with the second process fluid supply pipe.   
     
     
         12 . The substrate treating apparatus of  claim 11 , wherein the first pipe connection assembly further comprises:
 a first expansion pipe provided between the first protruding port and the first connection pipe when diameters of the first through-hole and the first process fluid supply pipe are different, and connected to the first protruding port and the first connection pipe by welding; and   a first protective cap provided to surround a weld between the first protruding port and the first expansion pipe and a weld between the first expansion pipe and the first connection pipe, and   the second pipe connection assembly further comprises:   
       a second expansion pipe provided between the second protruding port and the second connection pipe when diameters of the second through-hole and the second process fluid supply pipe are different, and connected to the second protruding port and the second connection pipe by welding; and
 a second protective cap provided to surround a weld between the second protruding port and the second expansion pipe and a weld between the second expansion pipe and the second connection pipe. 
 
     
     
         13 . The substrate treating apparatus of  claim 12 , wherein the first and second protective caps are provided to surround the joint. 
     
     
         14 . The substrate treating apparatus of  claim 12 , wherein the first expansion pipe and the second expansion pipe have a first end portion having a first inner diameter the same as inner diameters of the first and second protruding ports, a second end portion having a second inner diameter the same as inner diameters of the first and second connection pipes, and a connecting portion connecting the first end portion and the second end portion;
 the inner diameters of the first and second protruding ports are the same as inner diameters of the first and second through-holes;   the inner diameters of the first and second connection pipes are the same as inner diameters of the first and second process fluid supply pipes; and   the first and second through-holes have an inner diameter larger than the inner diameters of the first and second process fluid supply pipes.   
     
     
         15 . The substrate treating apparatus of  claim 11 , wherein the first and second through-holes have roughness the same as surface roughness of inner surfaces of the first and second process fluid supply pipes. 
     
     
         16 . The substrate treating apparatus of  claim 11 , wherein the first and second through-holes are electro-polished. 
     
     
         17 . The substrate treating apparatus of  claim 11 , wherein the process fluid is a supercritical fluid. 
     
     
         18 . A substrate treating apparatus comprising:
 a vessel providing a sealable treatment space through a combination of an upper body and a lower body; and   a substrate supporting member positioned in the treatment space of the vessel and supporting a substrate,   wherein the upper body and the lower body each comprise:   a through-hole formed through from an outer surface to an inner surface such that a process fluid is supplied to the treatment space; and   a pipe connection assembly provided on an outer surface on which the through-hole is formed, and provided for connection with a process fluid supply pipe, and   the pipe connection assembly comprises:   a protruding port through which the through-hole extends and that protrudes from the outer surface;   an expansion pipe connected to the protruding port by welding; and   a connection pipe connected to the expansion pipe by welding and having a joint for fitting with the process fluid supply pipe.   
     
     
         19 . The substrate treating apparatus of  claim 18 , wherein the pipe connection assembly further comprises a protective cap provided to surround a weld between the protruding port and the expansion pipe and a weld between the expansion pipe and the connection pipe. 
     
     
         20 . The substrate treating apparatus of  claim 19 , wherein the expansion pipe has a first end portion having a first inner diameter the same as an inner diameter of the protruding port, a second end portion having a second inner diameter the same as an inner diameter of the connection pipe, and a connecting portion connecting the first end portion and the second end portion;
 the inner diameter of the protruding port is the same as an inner diameter of the through-hole;   the inner diameter of the connection pipe is the same as an inner diameter of the process fluid supply pipe;   the first and second through-holes have an inner diameter larger than inner diameters of the first and second process fluid supply pipes; and   the through-hole has roughness the same as surface roughness of an inner surface of the process fluid supply pipe.