Component Carrier and Method of Manufacturing the Component Carrier

Abstract

A component carrier and a method of manufacturing the component carrier are presented. The component carrier comprises a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure, wherein the stack comprises i) a support layer structure comprising at least one through-hole; ii) a metal paste filling material in the through-hole; and iii) a metal pad provided on and extending from an exterior main surface of the support layer structure. The metal paste filling material in the through hole and the metal pad comprise at least partially the same material.

1 . A component carrier, comprising:
 a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure, wherein the stack comprises:   a support layer structure comprising at least one through-hole;   a metal paste filling material in the through-hole; and   a metal pad provided on and extending from an exterior main surface of the support layer structure;   wherein the metal paste filing material in the through hole and the metal pad comprise at least partially the same material.   
     
     
         2 . The component carrier according to  claim 1 ,
 wherein a ratio between a thickness of the support layer structure and a minimum width of the through-hole is at least 5.   
     
     
         3 . The component carrier according to  claim 1 ,
 wherein the support layer structure is configured as a support plate.   
     
     
         4 . The component carrier according to  claim 1 ,
 wherein the support layer structure comprises or consists of one of the following: glass, ceramic, a semiconductor.   
     
     
         5 . The component carrier according to  claim 1 ,
 wherein the thickness of the support layer structure is at least 500 μm.   
     
     
         6 . The component carrier according to  claim 1 ,
 wherein the metal paste filling material is in direct physical contact with sidewalls of the support layer structure delimiting the through-hole.   
     
     
         7 . The component carrier according to  claim 1 ,
 wherein the metal pad is a plating pad or   wherein the component carrier further comprises a plating pad on top of the metal pad.   
     
     
         8 . The component carrier according to  claim 1 , wherein at least one of the following features applies:
 wherein the through-hole has slanted sidewalls along its entire extension;   wherein the through-hole has an hourglass shape;   wherein the through-hole has a continuously tapering shape.   
     
     
         9 . The component carrier according to  claim 1 , further comprising:
 a further metal pad on an opposing main surface of the support layer structure and on an opposing end of the metal paste filling material.   
     
     
         10 . The component carrier according to  claim 9 ,
 wherein the further metal pad is a plating pad or   wherein the component carrier further comprises a further plating pad on top of the further metal pad.   
     
     
         11 . The component carrier according to  claim 1 ,
 wherein the metal paste filling material comprises metal particles and at least one of the following features:   the metal paste filling material comprises nano metal particles;   at least some of the metal particles are bound to each other;   the metal paste filling material comprises or consists of sintered particles;   at least some metal particles have a different material than the material of the metal pad;   the metal paste filling material is a porous material.   
     
     
         12 . The component carrier according to  claim 1 , configured as an inlay for a further component carrier layer stack. 
     
     
         13 . The component carrier according to  claim 1 ,
 wherein a portion of the metal paste filling material extends into the metal pad; and/or   wherein a portion of the material of the metal pad extends into the metal paste filling material.   
     
     
         14 . The component carrier according to  claim 13 ,
 wherein the portion of the metal paste filling material extending into the metal pad or the portion of the metal pad extending into the metal paste filling material comprises a round shape along the stack thickness direction; and/or   wherein the portion of the metal paste filling material extending into the metal pad or the portion of the metal pad extending into the metal paste filling material at least partially fills a void caused by an external roughness of the corresponding metal pad or metal paste filling material.   
     
     
         15 . The component carrier according to  claim 1 ,
 wherein the metal pad is made of the same material as the metal paste filling material.   
     
     
         16 . A method of manufacturing a component carrier, wherein the method comprises:
 providing a stack with at least one electrically conductive layer structure, at least one electrically insulating layer structure, and a support layer structure;   forming a through-hole in the support layer structure;   filling the through-hole with a metal paste filling material, comprising metal particles and a bonding material; and   forming a metal pad on and extending from an exterior main surface of the support layer structure;   wherein the metal paste filling material in the through hole and the metal pad comprise at least partially the same material.   
     
     
         17 . The method according to  claim 16 , further comprising:
 sintering the metal paste filling material after filling the metal paste filling material in the through-hole.   
     
     
         18 . The method according to  claim 17 , further comprising:
 sintering or plating the metal pad.   
     
     
         19 . The method according to  claim 16 , further comprising:
 forming a plating pad on top of the metal pad.   
     
     
         20 . The method according to  claim 16 ,
 wherein filling the through-hole with the metal paste filling material is performed by a roll coating machine.