Nozzle inspection method, nozzle inspection apparatus, and substrate processing device

Abstract

Provided is a nozzle inspection method, the nozzle inspection method including: an operation of forming a pattern for inspection, including a first chemical solution discharge operation of discharging a chemical solution onto a substrate in a first state in which a distance between a substrate and a first nozzle is a first distance and a second chemical solution discharge operation of discharging a chemical solution onto a substrate in a second state in which a distance between the substrate and the first nozzle is a second distance, different from the first distance; and an inspection operation of inspecting the pattern for inspection to determine whether a nozzle is defective.

What is claimed is: 
     
         1 . A nozzle inspection method, comprising:
 an operation of forming a pattern for inspection, including a first chemical solution discharge operation of discharging a chemical solution onto a substrate in a first state in which a distance between a substrate and a first nozzle is a first distance a second chemical solution discharge operation of discharging a chemical solution onto a substrate in a second state in which a distance between the substrate and the first nozzle is a second distance, different from the first distance; and   an inspection operation of inspecting the pattern for inspection to determine whether a nozzle is defective.   
     
     
         2 . The nozzle inspection method of  claim 1 , wherein a distance adjustment operation of moving the substrate or the first nozzle in a vertical direction is performed between the first chemical solution discharge operation and the second chemical solution discharge operation. 
     
     
         3 . The nozzle inspection method of  claim 1 , wherein the first chemical solution discharge operation or the second chemical solution discharge operation is performed while the substrate or the first nozzle is moved in a vertical direction. 
     
     
         4 . The nozzle inspection method of  claim 1 , wherein in the first chemical solution discharge operation, the chemical solution is discharged to a first region of interest of the substrate, and
 in the second chemical solution discharge operation, the chemical solution is discharged to a second region of interest, different from the first region of interest of the substrate.   
     
     
         5 . The nozzle inspection method of  claim 4 , wherein in the first chemical solution discharge operation, a chemical solution is discharged to a first position of the substrate,
 in the second chemical solution discharge operation, a chemical solution is discharged to a second position of the substrate, different from the first position, and   after the first chemical solution discharge operation, at least one of the substrate and the first nozzle is moved in a vertical direction and a horizontal direction.   
     
     
         6 . The nozzle inspection method of  claim 4 , wherein the inspection operation comprises an imaging operation of moving the substrate to a vision module, and then imaging the pattern for inspection, and an inspection operation of determining whether an image of the imaged pattern for inspection satisfies a preset condition, and
 in the inspection operation, when any one of the patterns discharged to the first region of interest and the second region of interest satisfies a preset condition, it is determined to be defective.   
     
     
         7 . The nozzle inspection method of  claim 1 , wherein the operation of forming the pattern for inspection further comprises a third chemical solution discharge operation of discharging a chemical solution onto a substrate in a third state in which a distance between the substrate and the first nozzle is a third distance, different from the first distance and the second distance. 
     
     
         8 . The nozzle inspection method of  claim 7 , wherein one of the first to third distances corresponds to a set distance between the substrate and the first nozzle, the other one of the first to third distances corresponds to a maximum distance between the substrate and the first nozzle in consideration of flatness of a printing substrate, and the remaining one of the first to third distances corresponds to a minimum distance between the substrate and the nozzle in consideration of the flatness of the printing substrate. 
     
     
         9 . The nozzle inspection method of  claim 8 , wherein the substrate is a substrate for inspection,
 the maximum distance is greater than or equal to a distance obtained by adding a difference between the flatness of the printing substrate and maximum flatness of the substrate for inspection to the set distance, and   the minimum distance is less than or equal to a distance obtained by subtracting the difference between the flatness of the printing substrate and the maximum flatness of the substrate for inspection from the set distance.   
     
     
         10 . The nozzle inspection method of  claim 2 , wherein the substrate is a substrate for inspection,
 a second nozzle is connected to an inkjet head to which the first nozzle is connected, and   in the operation of forming the pattern for inspection, the second nozzle also discharges a chemical solution together with the first nozzle.   
     
     
         11 . A nozzle inspection apparatus, comprising:
 a stage on which a substrate is moved;   an inkjet head module disposed on the stage, and including a first nozzle for discharging a chemical solution onto the substrate to form a pattern for inspection;   a vision module disposed on the stage, and imaging the pattern for inspection; and   a control module connected to the stage, the inkjet head module, and the vision module, forming the pattern for inspection, and determining whether the first nozzle is defective based on the imaging result,   wherein the control module controls the stage and the inkjet head module so that the pattern for inspection includes a pattern of a chemical solution discharged in a first state in which a distance between the substrate and the first nozzle is a first distance and in a second state in which a distance between the substrate and the first nozzle is a second distance, different from the first distance.   
     
     
         12 . The nozzle inspection apparatus of  claim 11 , wherein the control module discharges a chemical solution through a first nozzle of the inkjet head module while moving the substrate on the stage in a vertical direction. 
     
     
         13 . The nozzle inspection apparatus of  claim 11 , wherein the control module discharges a chemical solution through the first nozzle while moving the first nozzle in a vertical direction. 
     
     
         14 . The nozzle inspection apparatus of  claim 11 , wherein the control module discharges a chemical solution in the first state to a first position of the substrate, and discharges a chemical solution in the second state to a second position, different from the first position, to form the pattern for inspection. 
     
     
         15 . The nozzle inspection apparatus of  claim 11 , wherein the control module controls the stage and the inkjet head module so that the pattern for inspection includes a pattern discharged in a third state in which a distance between the substrate and the first nozzle is a third distance, different from the first distance and the second distance. 
     
     
         16 . The nozzle inspection apparatus of  claim 15 , wherein the substrate is a substrate for inspection, and
 one of the first to third distances corresponds to a set distance between a printing substrate and a first nozzle, the other one of the first to third distances corresponds to a maximum distance between the substrate and a nozzle in consideration of flatness of the printing substrate, and the remaining one of the first to third distances corresponds to a minimum distance between the printing substrate and the nozzle.   
     
     
         17 . The nozzle inspection apparatus of  claim 14 , wherein the inkjet head module further comprises a second nozzle, and
 when the control module discharges a chemical solution through the first nozzle, and also discharges a chemical solution through the second nozzle, so that the pattern for inspection includes a chemical solution pattern discharged from the first nozzle and a chemical solution pattern discharged from the second nozzle.   
     
     
         18 . The nozzle inspection apparatus of  claim 16 , wherein the first distance and the second distance fall within a range below a maximum distance and above a minimum distance between the substrate and the first nozzle or the substrate and the second nozzle, considering a height difference between the first nozzle and the second nozzle. 
     
     
         19 . A substrate processing device, comprising:
 a first stage disposed in a first region, a printing region;   a second stage disposed in a second region, an inspection region;   one or more gantries disposed to move the first and second stages;   an inkjet head module installed on the gantry and to which a first nozzle and a second nozzle discharging a chemical solution are connected;   a vision module installed on the gantry; and   a control module connected to the first and second stages, the gantry, the inkjet head module, and the vision module,   wherein the control module forms a pattern for inspection by discharging a chemical solution while changing a distance between the first nozzle and a substrate for inspection in the inspection region, and   the vision module images a pattern for inspection.   
     
     
         20 . The substrate processing device of  claim 19 , wherein the gantry comprises a first gantry to which the inkjet head module is connected and a second gantry to which the vision module is connected, and
 the control module changes a distance between the first and second nozzles and the substrate for inspection in consideration of flatness of a printing substrate supplied to the first region and flatness of the substrate for inspection in the second region.