Process kit de-bubbling

Abstract

In some examples, an electroplating apparatus is provided for depositing a metal layer on a substrate. An example electroplating apparatus comprises a plating cell to receive a plating solution, an electrode, a counter electrode, a substrate holding fixture, a resistive element, and a de-bubbler device supportable rotatably adjacent the resistive element to generate or direct a flow of plating solution through the resistive element to release trapped bubbles.

What is claimed is: 
     
         1 . An electroplating apparatus for depositing a metal layer on a substrate, the electroplating apparatus comprising:
 a plating cell to receive a plating solution;   an electrode;   a counter electrode;   a substrate holding fixture;   a resistive element; and   a de-bubbler device supportable rotatably adjacent the resistive element to generate or direct a flow of plating solution through the resistive element.   
     
     
         2 . The electroplating apparatus of  claim 1 , wherein the de-bubbler device is rotatable in use to generate an upward flow of plating solution through the resistive element to remove bubbles trapped thereunder. 
     
     
         3 . The electroplating apparatus of  claim 1 , wherein the dc-bubbler device is mountable in the substrate holding fixture. 
     
     
         4 . The electroplating apparatus of  claim 3 , wherein the de-bubbler device includes a wafer-shaped plate. 
     
     
         5 . The electroplating apparatus of  claim 1 , wherein the de-bubbler device includes a flow generation element. 
     
     
         6 . The electroplating apparatus of  claim 5 , wherein the flow generation element includes an impeller. 
     
     
         7 . The electroplating apparatus of  claim 1 , wherein the de-bubbler device includes a flow control element. 
     
     
         8 . The electroplating apparatus of  claim 7 , wherein the flow control element includes a cross-rib. 
     
     
         9 . A method of de-bubbling electroplating apparatus for depositing a metal layer on a substrate, the electroplating apparatus including a plating cell, a substrate holding fixture, a resistive element, and a de-bubbler device, the method comprising:
 introducing plating solution into the plating cell;   supporting a substrate in the substrate holding fixture;   depositing a metal layer on the substrate using the resistive element; and   generating an upward flow of plating solution through the resistive element using the de-bubbler device to release bubbles trapped under the resistive element.   
     
     
         10 . The method of  claim 9 , wherein generating an upward flow of plating solution through the resistive element includes mounting the de-bubbler device in the substrate holding fixture, and rotating the de-bubbler device to generate the upward flow. 
     
     
         11 . The method of  claim 10 , wherein rotating the de-bubbler device includes clocking the de-bubbler device into a clocked position with respect to the resistive element. 
     
     
         12 . The method of  claim 10 , further comprising advancing or retreating the de-bubbler device towards or away from the resistive element while rotating the de-bubbler device. 
     
     
         13 . A de-bubbler device for de-bubbling electroplating apparatus, the de-bubbler device comprising:
 a back plate, and   at least one flow generation element, or   at least one flow control element.   
     
     
         14 . The de-bubbler device of  claim 13 , wherein the back plate is wafer-shaped and the de-bubbler device is mountable in a substrate support fixture of the electroplating apparatus. 
     
     
         15 . The de-bubbler device of  claim 14 , wherein the at least one flow generation element includes an impeller. 
     
     
         16 . The de-bubbler device of  claim 15 , wherein a distal end of the impeller is disposed at or adjacent a periphery of the back plate. 
     
     
         17 . The de-bubbler device of  claim 13 , wherein the at least one flow control element includes a rib. 
     
     
         18 . The de-bubbler device of  claim 13 , wherein the electroplating apparatus includes a resistive device, and wherein the at least one flow control element of the de-bubbler device is configured to interact with a flow control element of the resistive device in a clocked position of the de-bubbler device. 
     
     
         19 . The de-bubbler device of  claim 13 , wherein the at least one flow control element extends fully across the de-bubbler device between peripheral positions on the back plate. 
     
     
         20 . The de-bubbler device of  claim 13 , further comprising a plurality of flow control elements, each flow control element associated with a corresponding, clocked position of the de-bubbler device. 
     
     
         21 . A de-bubbler device for de-bubbling electroplating apparatus, the de-bubbler device comprising:
 a back plate, the back plate having a wafer-shaped configuration enabling the de-bubbler device to be mounted in a substrate support fixture of the electroplating apparatus;   an arrangement of flow generation elements including a plurality of linear ribs arranged in a cross-hatch pattern, each linear rib extending between peripheral locations of the back plate and standing proud of an underside of the back plate, the cross-hatch pattern of linear ribs including a plurality of rib joinder points and a plurality of rectilinear recesses disposed between adjacent ribs; and   a plurality of flow elements, each flow control element including a linear baffle extending between peripheral locations of the back plate, the linear baffle configured to lie adjacent an opposed flow control element of a resistive element in a clocked position of the de-bubbler device in an electroplating apparatus.