Assignee
LAM RES CORP
US·3,256 granted patents·1,100 pending applications·83,218 citations·filing 1981–2025
Top patents by PatentIndex Score
4,356 records- 0199US11721558B2Designer atomic layer etchingLAM RES CORP·Filed 2021·Granted Aug 8, 2023·7 cites·10 claims
- 0299US10870922B2Moment cancelling pad raising mechanism in wafer positioning pedestal for semiconductor processingLAM RES CORP·Filed 2020·Granted Dec 22, 2020·6 cites·13 claims
- 0399US10121689B2Moment cancelling pad raising mechanism in wafer positioning pedestal for semiconductor processingLAM RES CORP·Filed 2018·Granted Nov 6, 2018·43 cites·22 claims
- 0499US10109517B1Rotational indexer with additional rotational axesLAM RES CORP·Filed 2018·Granted Oct 23, 2018·58 cites·20 claims
- 0599US9997357B2Capped ALD films for doping fin-shaped channel regions of 3-D IC transistorsLAM RES CORP·Filed 2014·Granted Jun 12, 2018·430 cites·22 claims
- 0699US9997373B2Technique to deposit sidewall passivation for high aspect ratio cylinder etchLAM RES CORP·Filed 2016·Granted Jun 12, 2018·434 cites·25 claims
- 0799US9911595B1Selective growth of silicon nitrideLAM RES CORP·Filed 2017·Granted Mar 6, 2018·388 cites·17 claims
- 0899US9865815B2Bromine containing silicon precursors for encapsulation layersLAM RES CORP·Filed 2016·Granted Jan 9, 2018·434 cites·19 claims
- 0999US9745658B2Chamber undercoat preparation method for low temperature ALD filmsLAM RES CORP·Filed 2013·Granted Aug 29, 2017·375 cites·16 claims
- 1099US9601693B1Method for encapsulating a chalcogenide materialLAM RES CORP·Filed 2015·Granted Mar 21, 2017·43 cites·19 claims
- 1199US9508529B2System, method and apparatus for RF power compensation in a plasma processing systemLAM RES CORP·Filed 2014·Granted Nov 29, 2016·123 cites·18 claims
- 1299US9431268B2Isotropic atomic layer etch for silicon and germanium oxidesLAM RES CORP·Filed 2015·Granted Aug 30, 2016·135 cites·20 claims
- 1399US9396961B2Integrated etch/clean for dielectric etch applicationsLAM RES CORP·Filed 2015·Granted Jul 19, 2016·105 cites·26 claims
- 1499US9385318B1Method to integrate a halide-containing ALD film on sensitive materialsLAM RES CORP·Filed 2015·Granted Jul 5, 2016·50 cites·19 claims
- 1599US7998875B2Vapor phase repair and pore sealing of low-K dielectric materialsLAM RES CORP·Filed 2008·Granted Aug 16, 2011·517 cites·20 claims
- 1699US7858898B2Bevel etcher with gap controlLAM RES CORP·Filed 2007·Granted Dec 28, 2010·349 cites·19 claims
- 1799US7758764B2Methods and apparatus for substrate processingLAM RES CORP·Filed 2007·Granted Jul 20, 2010·76 cites·28 claims
- 1899US7651269B2Temperature probes having a thermally isolated tipLAM RES CORP·Filed 2007·Granted Jan 26, 2010·498 cites·20 claims
- 1999US7645341B2Showerhead electrode assembly for plasma processing apparatusesLAM RES CORP·Filed 2003·Granted Jan 12, 2010·576 cites·12 claims
- 2099US7611640B1Minimizing arcing in a plasma processing chamberLAM RES CORP·Filed 2006·Granted Nov 3, 2009·365 cites·33 claims
- 2199US7497614B2Apparatus for determining a temperature of a substrate and methods thereforLAM RES CORP·Filed 2007·Granted Mar 3, 2009·468 cites·25 claims
- 2299US7086347B2Apparatus and methods for minimizing arcing in a plasma processing chamberLAM RES CORP·Filed 2002·Granted Aug 8, 2006·380 cites·31 claims
- 2399US6949204B1Deformation reduction at the main chamberLAM RES CORP·Filed 2004·Granted Sep 27, 2005·415 cites·6 claims
- 2499US6847014B1Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece supportLAM RES CORP·Filed 2002·Granted Jan 25, 2005·704 cites·23 claims
- 2599US6391787B1Stepped upper electrode for plasma processing uniformityLAM RES CORP·Filed 2000·Granted May 21, 2002·153 cites·29 claims
- 2699US6320320B1Method and apparatus for producing uniform process ratesLAM RES CORP·Filed 1999·Granted Nov 20, 2001·411 cites·40 claims
- 2799US6129808ALow contamination high density plasma etch chambers and methods for making the sameLAM RES CORP·Filed 1998·Granted Oct 10, 2000·215 cites·38 claims
- 2899US5234526AWindow for microwave plasma processing deviceLAM RES CORP·Filed 1991·Granted Aug 10, 1993·449 cites·37 claims
- 2998US12278125B2Integrated dry processes for patterning radiation photoresist patterningLAM RES CORP·Filed 2023·Granted Apr 15, 2025·8 cites·19 claims
- 3098US12183604B2Integrated dry processes for patterning radiation photoresist patterningLAM RES CORP·Filed 2023·Granted Dec 31, 2024·9 cites·37 claims
- 3198US12094711B2Tin oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2022·Granted Sep 17, 2024·5 cites·18 claims
- 3298US12074029B2Molybdenum depositionLAM RES CORP·Filed 2022·Granted Aug 27, 2024·8 cites·11 claims
- 3398US12051589B2Tin oxide thin film spacers in semiconductor device manufacturingLAM RES CORP·Filed 2021·Granted Jul 30, 2024·6 cites·17 claims
- 3498US11817341B2Electrostatic chuck for use in semiconductor processingLAM RES CORP·Filed 2022·Granted Nov 14, 2023·4 cites·20 claims
- 3598US11784047B2Tin oxide thin film spacers in semiconductor device manufacturingLAM RES CORP·Filed 2021·Granted Oct 10, 2023·10 cites·17 claims
- 3698US11637037B2Method to create air gapsLAM RES CORP·Filed 2020·Granted Apr 25, 2023·12 cites·16 claims
- 3798US11264207B2Apparatuses and methods for avoiding electrical breakdown from RF terminal to adjacent non-RF terminalLAM RES CORP·Filed 2020·Granted Mar 1, 2022·8 cites·20 claims
- 3898US11257674B2Eliminating yield impact of stochastics in lithographyLAM RES CORP·Filed 2020·Granted Feb 22, 2022·15 cites·19 claims
- 3998US11209729B2Vacuum-integrated hardmask processes and apparatusLAM RES CORP·Filed 2019·Granted Dec 28, 2021·21 cites·14 claims
- 4098US11183383B2Tin oxide thin film spacers in semiconductor device manufacturingLAM RES CORP·Filed 2020·Granted Nov 23, 2021·16 cites·18 claims
- 4198US11069535B2Atomic layer etch of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2020·Granted Jul 20, 2021·7 cites·19 claims
- 4298US11056380B2Wafer positioning pedestal for semiconductor processingLAM RES CORP·Filed 2020·Granted Jul 6, 2021·4 cites·13 claims
- 4398US10916434B2Feature fill with multi-stage nucleation inhibitionLAM RES CORP·Filed 2020·Granted Feb 9, 2021·9 cites·19 claims
- 4498US10831096B2Vacuum-integrated hardmask processes and apparatusLAM RES CORP·Filed 2018·Granted Nov 10, 2020·34 cites·18 claims
- 4598US10566212B2Designer atomic layer etchingLAM RES CORP·Filed 2017·Granted Feb 18, 2020·26 cites·9 claims
- 4698US10514598B2Vacuum-integrated hardmask processes and apparatusLAM RES CORP·Filed 2017·Granted Dec 24, 2019·33 cites·10 claims
- 4798US10410836B2Systems and methods for tuning to reduce reflected power in multiple statesLAM RES CORP·Filed 2018·Granted Sep 10, 2019·30 cites·20 claims
- 4898US10347547B2Suppressing interfacial reactions by varying the wafer temperature throughout depositionLAM RES CORP·Filed 2016·Granted Jul 9, 2019·401 cites·20 claims
- 4998US10264663B1Matchless plasma source for semiconductor wafer fabricationLAM RES CORP·Filed 2017·Granted Apr 16, 2019·29 cites·46 claims
- 5098US10177024B2High temperature substrate pedestal module and components thereofLAM RES CORP·Filed 2015·Granted Jan 8, 2019·371 cites·11 claims
Showing the top 50 of 4,356 patent records by PatentIndex Score.
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