US2021307151A1PendingUtilityA1

Air Leak Detection In Plasma Processing Apparatus With Separation Grid

Assignee: MATTSON TECH INCPriority: Jan 28, 2019Filed: Jun 14, 2021Published: Sep 30, 2021
Est. expiryJan 28, 2039(~12.5 yrs left)· nominal 20-yr term from priority
H01J 37/32798H01J 37/32972H05H 1/0037H01J 37/32449G01N 21/766G01N 21/00
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Claims

Abstract

Plasma processing apparatus and associated methods for detecting air leak are provided. In one example implementation, the plasma processing apparatus can include a processing chamber to process a workpiece, a plasma chamber separated from the processing chamber by a separation grid, and an inductive coupling element to induce an oxygen plasma using a process gas in the plasma chamber. The plasma processing apparatus can detect afterglow emission strength from reaction between nitric oxide (NO) and oxygen radical(s) in a process space downstream to an oxygen plasma to measure nitrogen concentrations due to presence of air leak.

Claims

exact text as granted — not AI-modified
1 - 17 . (canceled) 
     
     
         18 . A plasma processing apparatus for detecting presence of nitrogen, comprising:
 a processing chamber having a workpiece support, the workpiece support configured to support a workpiece during plasma processing;   a plasma chamber separated from the processing chamber by a separation grid;   an inductive coupling element configured to induce a plasma using a process gas in the plasma chamber, the process gas comprising an oxygen-containing gas;   a controller configured to:
 obtain data associated with luminescence in the processing chamber, 
 wherein the luminescence is emitted from excited nitrogen dioxide molecules; 
   determine the presence of nitrogen in the plasma processing apparatus based at least in part on the data associated with the luminescence;   wherein the one or more oxygen radicals generated in the plasma pass through the separation grid for exposure to the workpiece.   
     
     
         19 . The plasma processing apparatus of  claim 18 , wherein the controller is configured to obtain the data associated with luminescence from a location between the separation grid and the workpiece. 
     
     
         20 . The plasma processing apparatus of  claim 18 , wherein the controller is configured to obtain the data associated with luminescence from a location proximate to a gas exhaust port for evacuating a gas from the processing chamber.

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