Film removing method, substrate treating method, and substrate treating apparatus

Abstract

Disclosed is a method for removing a film from a substrate by irradiating a plurality of unit pulse laser beams to an edge region of the substrate. The method includes a first irradiation operation for irradiating a plurality of unit pulse laser beams onto the substrate while the substrate is rotating, and a second irradiation operation for irradiating a plurality of unit pulse laser beams to regions of the substrate onto which the unit pulse laser beams are not irradiated in the first irradiation operation.

1 .- 16 . (canceled) 
     
     
         17 . An apparatus for treating a substrate, the apparatus comprising:
 a housing having an inner space;   a support unit received in the inner space for supporting and rotating the substrate;   a laser irradiation unit for irradiating a plurality of unit pulse laser beams onto the substrate supported on the support unit; and   a controller to control the support unit and the laser irradiation unit,   wherein the controller is configured to:   control the support unit to rotate the substrate supported on the support unit;   control a combination of the support unit and the laser irradiation unit to perform a first irradiation operation for irradiating a plurality of unit pulse laser beams to the substrate while the substrate is rotating, wherein in the first irradiation operation, a pulse width of each of the unit pulse laser beams is set so that regions of the substrate onto which the unit pulse laser beams are irradiated respectively do not overlap each other; and   control a combination of the support unit and the laser irradiation unit to perform a second irradiation operation for irradiating a plurality of unit pulse laser beams to the substrate while the substrate is rotating, wherein in the second irradiation operation, the unit pulse laser beams are respectively irradiated onto regions between adjacent regions among the regions receiving the unit pulse laser beams respectively in the first irradiation operation.   
     
     
         18 . The apparatus of  claim 17 , wherein the controller is further configured to control a combination of the support unit and the laser irradiation unit such that the second irradiation operation is performed when a preset time has elapsed after the first irradiation operation is completed. 
     
     
         19 . The apparatus of  claim 17 , wherein the controller is further configured to control the laser irradiation unit such that each of the unit pulse laser beams has a wavelength below an ablation threshold at which ablation occurs in the film. 
     
     
         20 . The apparatus of  claim 19 , wherein the controller is further configured to control the laser irradiation unit such that each of the unit pulse laser beams has a wavelength of 150 nm to 1200 nm. 
     
     
         21 . The apparatus of  claim 17 , wherein the laser irradiation unit includes:
 a laser light source for generating the unit pulse laser beams;   a laser irradiation member for irradiating the unit pulse laser beams received from the laser light source to the substrate supported on the support unit; and   a driving member for moving the laser irradiation member so that an irradiation position of the unit pulse laser beams varies along a radial direction of the substrate.   
     
     
         22 . The apparatus of  claim 21 , wherein the controller is further configured to control the laser irradiation member to irradiate the unit pulse laser beams to an edge region of the substrate supported on the support unit. 
     
     
         23 . The apparatus of  claim 21 , wherein the laser irradiation unit further includes:
 a wavelength adjusting member for changing a wavelength of each of the unit pulse laser beams received from the laser light source; and   a shape adjusting member for changing a shape of each of the unit pulse laser beams received from the laser light source.   
     
     
         24 . The apparatus of  claim 23 , wherein the shape adjusting member changes a shape of each of the unit pulse laser beams to a cross-sectional circular shape. 
     
     
         25 . The apparatus of  claim 23 , wherein the shape adjusting member changes a shape of each of the unit pulse laser beams to a cross-sectional quadrangular shape.