US2020333083A1PendingUtilityA1

Heat dissipating module with two vapor chambers

Assignee: TAIWAN MICROLOOPS CORPPriority: Apr 16, 2019Filed: Apr 16, 2019Published: Oct 22, 2020
Est. expiryApr 16, 2039(~12.7 yrs left)· nominal 20-yr term from priority
Inventors:Chun-Hung Lin
H10W 40/73H10W 40/226F28D 15/043F28D 15/0233F28D 15/0266F28D 15/0275
43
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A heat dissipating module includes a lower vapor chamber, an upper vapor chamber, a heat pipe and fins. The lower and upper vapor chambers have a first chamber and a second chamber, respectively. The upper vapor chamber is disposed over the upper vapor chamber. The heat pipe is connected between the lower vapor chamber and the upper vapor chamber and has a third chamber. The first chamber, the second chamber and the third chamber communicate with each other. The fins are parallelly upright connected between the lower vapor chamber and the upper vapor chamber. Upper ends and lower ends of the fins connect to the upper vapor chamber and the lower vapor chamber, respectively.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A heat dissipating module for a heating element, comprising:
 a lower vapor chamber, having a first chamber, and attached by the heat element;   an upper vapor chamber, disposed over the upper vapor chamber, and having a second chamber;   at least one heat pipe, connected between the lower vapor chamber and the upper vapor chamber, and having a third chamber, wherein the first chamber, the second chamber and the third chamber communicate with each other; and   a plurality of fins, parallelly upright connected between the lower vapor chamber and the upper vapor chamber, wherein upper ends and lower ends of the fins connect to the upper vapor chamber and the lower vapor chamber, respectively.   
     
     
         2 . The heat dissipating module of  claim 1 , wherein parts of the fins are connected to the heat pipe. 
     
     
         3 . The heat dissipating module of  claim 1 , wherein the lower vapor chamber has a first side and a second side, which are opposite to each other, the lower vapor chamber further has a middle section between the first side and the second side, and the heat pipe is one in number and is disposed in the middle section. 
     
     
         4 . The heat dissipating module of  claim 1 , wherein the lower vapor chamber has a first side and a second side, which are opposite to each other, the lower vapor chamber further has a middle section between the first side and the second side, and the heat pipe is more than one in number and is disposed in the middle section at regular intervals. 
     
     
         5 . The heat dissipating module of  claim 1 , further comprising a wick structure and working fluid, the wick structure being attached on inner sides of the lower vapor chamber, the upper vapor chamber and the heat pipe, and the working fluid being received in the first chamber, the second chamber and the third chamber. 
     
     
         6 . The heat dissipating module of  claim 5 , wherein the wick structure is one or more of grooves, mesh, fibers, sintered powder and waved plates. 
     
     
         7 . The heat dissipating module of  claim 1 , wherein the heat pipe corresponds to the heating element in position.

Join the waitlist — get patent alerts

Track US2020333083A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.