Heat dissipating device

Abstract

A heat dissipating device includes an extruded heat sink and a fan, and the extruded heat sink includes a base, a multiple of cooling fins extending outwardly from the periphery of the base, a vacuum chamber formed directly in the base, and a capillary tissue disposed in the vacuum chamber and filled with a working fluid. The fan is mounted onto the extruded heat sink. Therefore, the heat conduction and dissipation rate of the extruded heat sink can be increased to improve the overall heat dissipation performance.

What is claimed is: 
     
         1 . A heat dissipating device, comprising:
 an extruded heat sink, including a base, a plurality of cooling fins extending outwardly from the periphery of the base, a vacuum chamber formed directly in the base, and a capillary tissue disposed in the vacuum chamber and filled with a working fluid; and   a fan, mounted onto the extruded heat sink.   
     
     
         2 . The heat dissipating device of  claim 1 , wherein the base has an accommodating groove formed therein, and a cover is installed at an end of the base corresponding to the accommodating groove, and the vacuum chamber is formed between the accommodating groove and the cover. 
     
     
         3 . The heat dissipating device of  claim 2 , wherein the cover comprises a bottom plate, and the capillary tissue is distributed on an inner surface of the bottom plate. 
     
     
         4 . The heat dissipating device of  claim 3 , wherein the cover further comprises a plurality of support columns extending outwardly from the bottom plate, another capillary tissue distributed on a surface of each support column, and each support column and the other capillary tissue are attached to the capillary tissue. 
     
     
         5 . The heat dissipating device of  claim 1 , wherein each of the cooling fins extends outwardly in a radial form from the base periphery, and each of the cooling fins and the base are integrally formed. 
     
     
         6 . The heat dissipating device of  claim 1 , wherein each of the cooling fins has a connection end and a free end disposed away from the connection end, and the connection end is coupled to the periphery of the base, and the base has a central axis, and each free end is formed around the central axis of the base and bent in the clockwise direction. 
     
     
         7 . The heat dissipating device of  claim 6 , wherein the fan is an axial flow fan, and the fan comprises an impeller, and the rotating direction of the impeller is opposite to that of each of the cooling fins. 
     
     
         8 . The heat dissipating device of  claim 1 , wherein each of the cooling fins has a connection end and a free end disposed away from the connection end, and the connection end is coupled to the periphery of the base, and the base has a central axis, and each of the free ends is formed around the central axis of the base and bent in a counterclockwise. 
     
     
         9 . The heat dissipating device of  claim 1 , wherein the extruded heat sink further comprises a plurality of arms spaced from one another and disposed between the cooling fins, and an end of each arm extends outwardly from the periphery of the base, and an end of each arm away from the base has a first fixing hole and a second fixing hole. 
     
     
         10 . The heat dissipating device of  claim 1 , wherein each cooling fin has a height greater than the height of the base, and a fan pocket is formed at the top of the base and in the area of the outer periphery of the base, and the fan comprises an impeller installed in the fan pocket.