Methods of Manufacturing Flexible Electronic Devices

Abstract

A method of manufacturing a flexible electronic device is described. The method comprises arranging an electronic component on a temporary carrier, providing a flexible laminate comprising an adhesive layer, pressing the temporary carrier and the flexible laminate together with the adhesive layer facing the temporary carrier such that the electronic component is pushed into the adhesive layer, and removing the temporary carrier. Further, a corresponding flexible electronic device is described.

1 . A flexible printed circuit board, comprising:
 an embedded electronic component.   
     
     
         2 . The flexible printed circuit board according to  claim 1 , wherein the electronic component is a flexible electronic component. 
     
     
         3 . The flexible printed circuit board according to  claim 1 , further comprising:
 an electrically conductive layer, wherein the embedded electronic component comprises at least one contact terminal which is in direct contact with the electrically conductive layer.   
     
     
         4 . The flexible printed circuit board according to  claim 1 , wherein the embedded electronic component is embedded in different insulating layers. 
     
     
         5 . The flexible printed circuit according to  claim 4 , wherein the different insulating layers are comprised by a flexible laminate. 
     
     
         6 . The flexible printed circuit according to  claim 3 , wherein the flexible printed circuit board comprises a further conductive layer, wherein the embedded electronic component is connected to the electrically conductive layer and the further conductive layer. 
     
     
         7 . The flexible printed circuit board according to  claim 1 , wherein the embedded electronic component is a sensor. 
     
     
         8 . The flexible printed circuit board according to  claim 7 , further comprising:
 an opening exposing at least a part of the sensor.   
     
     
         9 . The flexible printed circuit board according to  claim 1 , wherein the flexible printed circuit board is part of an electronic package. 
     
     
         10 . The flexible printed circuit board according to  claim 9 , wherein the electronic package is a flexible electronic package. 
     
     
         11 . A flexible electronic package, comprising:
 a flexible printed circuit board, the flexible printed circuit board comprising an embedded electronic component.   
     
     
         12 . The flexible electronic package according to  claim 11 , wherein the embedded electronic component is a flexible electronic component. 
     
     
         13 . The flexible electronic package according to  claim 11 , further comprising:
 a further flexible printed circuit board, the further flexible printed circuit board comprising a further electronic component.   
     
     
         14 . The flexible electronic package according to  claim 13 , wherein the further electronic component is a flexible electronic component. 
     
     
         15 . The flexible electronic package according to  claim 13 , further comprising:
 a bonding layer, wherein the flexible printed circuit board and the further flexible printed circuit board are interconnected via the bonding layer.