Apparatus and method for treating substrate

Abstract

An apparatus for treating a substrate includes a drying chamber that performs a drying process on the substrate having an organic solvent remaining on an upper surface thereof, a bake chamber that heats the substrate subjected to the drying process, and a transfer assembly that transfers the substrate between the drying chamber and the bake chamber.

What is claimed is: 
     
         1 . An apparatus for treating a substrate, the apparatus comprising:
 an index module;   a cleaning process module configured to perform a cleaning process on the substrate; and   a bake chamber configured to heat the substrate,   wherein the index module includes:   a load port on which a carrier having the substrate received therein is placed; and   a transfer frame disposed between the load port and the cleaning process module and including an index robot configured to transfer the substrate between the carrier placed on the load port and the cleaning process module,   wherein the cleaning process module includes:   a drying chamber configured to perform a drying process on the substrate having an organic solvent remaining on an upper surface thereof; and   a transfer chamber including a transfer robot configured to transfer the substrate in the cleaning process chamber, and   wherein the bake chamber heats the substrate subjected to the drying process.   
     
     
         2 . The apparatus of  claim 1 , wherein the cleaning process module further includes:
 a liquid processing chamber configured to perform liquid processing on the substrate by supplying the organic solvent to the substrate.   
     
     
         3 . The apparatus of  claim 1 , wherein the drying chamber treats the substrate by supplying a supercritical fluid to the substrate. 
     
     
         4 . The apparatus of  claim 1 , wherein the drying chamber includes a liquid supply unit configured to supply the organic solvent to the substrate. 
     
     
         5 . The apparatus of  claim 1 , wherein the bake chamber includes:
 a housing having an interior space; and   a heating member configured to heat the substrate to thermally decompose an impurity adhering to the substrate.   
     
     
         6 . The apparatus of  claim 5 , wherein the bake chamber further includes a controller configured to control the heating member, and
 wherein the controller controls the heating member to heat the substrate above a thermal decomposition temperature of the impurity adhering to the substrate.   
     
     
         7 . The apparatus of  claim 6 , wherein the impurity includes carbon, and
 wherein the controller controls the heating member to heat the substrate to a temperature of 600° C. or more.   
     
     
         8 . The apparatus of  claim 5 , wherein the heating member is a flash lamp configured to supply light to the substrate to heat the substrate. 
     
     
         9 . The apparatus of  claim 5 , wherein the bake chamber further includes:
 a gas supply member configured to supply an inert gas into the interior space; and   an exhaust line configured to discharge the inert gas.   
     
     
         10 . The apparatus of  claim 9 , wherein the gas supply member and the exhaust line are located in a higher position than the substrate located in the interior space. 
     
     
         11 . The apparatus of  claim 9 , wherein the gas supply member includes a plurality of gas supply members attached to a sidewall of the housing, and
 wherein the exhaust line is located in an area facing the gas supply member.   
     
     
         12 . The apparatus of  claim 1 , wherein the bake chamber is provided on the index module. 
     
     
         13 . The apparatus of  claim 1 , wherein the bake chamber is provided to be detachable from the index module. 
     
     
         14 . The apparatus of  claim 1 , wherein the index module and the cleaning process module are arranged along a first direction,
 wherein the load port includes a plurality of load ports,   wherein the plurality of load ports are arranged along a second direction perpendicular to the first direction, and   wherein the bake chamber and the plurality of load ports are arranged in a row along the second direction.   
     
     
         15 . The apparatus of  claim 1 , wherein the bake chamber is provided in the cleaning process module. 
     
     
         16 . The apparatus of  claim 15 , wherein the bake chamber is provided between the index module and the drying chamber. 
     
     
         17 . The apparatus of  claim 15 , wherein the index module and the cleaning process module are arranged along a first direction, and
 wherein the index module, the drying chamber, and the bake chamber are sequentially arranged along the first direction.   
     
     
         18 . The apparatus of  claim 1 , further comprising:
 a controller configured to control the apparatus,   wherein the controller controls the transfer robot or the index robot such that the organic solvent supplied to the substrate is dried in the drying chamber and thereafter the substrate is heated in the bake chamber to thermally decompose an impurity adhering to the substrate.   
     
     
         19 . An apparatus for treating a substrate, the apparatus comprising:
 a drying chamber configured to perform a drying process on the substrate having an organic solvent remaining on an upper surface thereof;   a bake chamber configured to heat the substrate subjected to the drying process; and   a transfer assembly configured to transfer the substrate between the drying chamber and the bake chamber.   
     
     
         20 . The apparatus of  claim 19 , further comprising:
 a liquid processing chamber configured to perform liquid processing on the substrate by supplying the organic solvent to the substrate.   
     
     
         21 . The apparatus of  claim 19 , wherein the drying chamber treats the substrate by supplying a supercritical fluid to the substrate. 
     
     
         22 . The apparatus of  claim 19 , further comprising:
 a heating member configured to heat the substrate to thermally decompose an impurity adhering to the substrate.   
     
     
         23 . The apparatus of  claim 19 , wherein the bake chamber includes:
 a housing having an interior space;   a heating member configured to heat the substrate to thermally decompose an impurity adhering to the substrate; and   a controller configured to control the heating member, and   wherein the controller controls the heating member to heat the substrate above a thermal decomposition temperature of the impurity adhering to the substrate.   
     
     
         24 . The apparatus of  claim 23 , wherein the impurity includes carbon, and
 wherein the controller controls the heating member to heat the substrate to a temperature of 600° C. or more.   
     
     
         25 . The apparatus of  claim 23 , wherein the bake chamber further includes:
 a gas supply member configured to supply an inert gas into the interior space; and   an exhaust line configured to discharge the inert gas.   
     
     
         26 . The apparatus of  claim 25 , wherein the gas supply member and the exhaust line are located in a higher position than the substrate located in the interior space. 
     
     
         27 . The apparatus of  claim 25 , wherein the gas supply member includes a plurality of gas supply members attached to a sidewall of the housing, and
 wherein the exhaust line is located in an area facing the gas supply member.   
     
     
         28 . A method for treating a substrate, the method comprising:
 a solvent processing step of supplying an organic solvent onto the substrate to treat the substrate;   a drying step of drying the substrate to remove the organic solvent on the substrate; and   a bake step of heating the substrate to thermally decompose an impurity adhering to the substrate,   wherein the drying step and the bake step are performed in different chambers.   
     
     
         29 . The method of  claim 28 , wherein in the drying step, a supercritical fluid is supplied onto the substrate to dry the substrate. 
     
     
         30 . The method of  claim 28 , wherein the bake step is performed in a bake chamber including a heating member configured to heat the substrate,
 wherein the bake chamber includes a plurality of bake chambers,   wherein the plurality of bake chambers include different heating members, and   wherein a bake chamber with the heating member that is selected depending on the substrate, among the plurality of bake chambers, is mounted in a substrate treating apparatus in which a drying chamber configured to perform the drying step is installed, and the bake step is performed in the selected bake chamber.   
     
     
         31 . The method of  claim 30 , wherein the heating member of the bake chamber is a selected one of a flash lamp, an infrared lamp, an ultraviolet lamp, a laser, and a heating wire.