Component Carrier With a Photoimageable Dielectric Layer and a Structured Conductive Layer Being Used as a Mask for Selectively Exposing the Photoimageable Dielectric Layer With Electromagnetic Radiation

Abstract

A component carrier with a layer stack having at least one component carrier material and a photoimageable dielectric layer structure formed on top of the layer stack. The photoimageable dielectric layer structure has at least one recess extending vertically through the photoimageable dielectric layer structure. The at least one recess is formed by partially removing the photoimageable dielectric layer structure in regions which are defined by a spatial pattern of an electrically conductive layer structure formed on the photoimageable dielectric layer structure. The spatial pattern defines openings formed within the electrically conductive layer structure. A method for manufacturing such a component carrier is also described.

1 . A component carrier, comprising:
 a layer stack comprising at least one component carrier material; and   a photoimageable dielectric layer structure formed on top of the layer stack, wherein the photoimageable dielectric layer structure has at least one recess extending vertically through the photoimageable dielectric layer structure, the at least one recess being formed by partially removing the photoimageable dielectric layer structure in regions which are defined by a spatial pattern of an electrically conductive layer structure being formed on the photoimageable dielectric layer structure, and   wherein the spatial pattern comprises openings formed within the electrically conductive layer structure.   
     
     
         2 . The component carrier as set forth  claim 1 , wherein the electrically conductive layer structure is formed on the photoimageable dielectric layer structure. 
     
     
         3 . The component carrier as set forth in  claim 1 , wherein the electrically conductive layer structure comprises at least one of the group consisting of copper, aluminum, nickel, silver, titanium, and gold. 
     
     
         4 . The component carrier as set forth in  claim 1 , further comprising: an electrically conductive material provided within the at least one recess and/or formed on the electrically conductive layer structure. 
     
     
         5 . The component carrier as set forth in  claim 4 , wherein the electrically conductive material provided within the at least one recess forms at least one of a via connection extending through the photoimageable dielectric layer structure and a pattern within a plane being perpendicular to the vertical extension of the recess. 
     
     
         6 . The component carrier as set forth in  claim 1 , wherein the recess forms a cavity within the photoimageable dielectric layer structure. 
     
     
         7 . The component carrier as set forth in  claim 6 , further comprising:
 at least one component being accommodated within the at least one recess.   
     
     
         8 . The component carrier as set forth in  claim 7 , wherein the at least one component is selected from a group consisting of an electronic component, an electrically non-conductive and/or electrically conductive inlay, a heat transfer unit, an energy harvesting unit, an active electronic component, a passive electronic component, an electronic chip, a storage device, a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a voltage converter, a cryptographic component, a transmitter and/or receiver, an electromechanical transducer, an actuator, a microelectromechanical system, a microprocessor, a capacitor, a resistor, an inductance, an accumulator, a switch, a camera, an antenna, a magnetic element, a further component carrier and a logic chip. 
     
     
         9 . The component carrier as set forth in  claim 1 , further comprising:
 a further photoimageable dielectric layer structure formed at the bottom of the layer stack, wherein the further photoimageable dielectric layer structure has at least one further recess extending vertically through the further photoimageable dielectric layer structure, the at least one further recess being formed by partially removing the further photoimageable dielectric layer structure in further regions which are defined by a further spatial pattern of a further electrically conductive layer structure being formed at the bottom of the further photoimageable dielectric layer structure, wherein the further spatial pattern comprises further openings formed within the further electrically conductive layer structure.   
     
     
         10 . The component carrier as set forth in  claim 1 , wherein the layer stack comprises at least a part of a wafer. 
     
     
         11 . The component carrier as set forth in  claim 10 , wherein the layer stack further comprises:
 at least a part of a further wafer; and   
       a carrier structure formed in between the wafer and the further wafer. 
     
     
         12 . The component carrier as set forth in  claim 1 , wherein the component carrier is configured as a laminate-type component carrier. 
     
     
         13 . The component carrier as set forth in  claim 1 , wherein the component carrier material comprises at least one of the group consisting of resin, epoxy resin or Bismaleimide-Triazine resin, cyanate ester, polyphenylene derivate, glass, prepreg material, polyimide, polyamide, liquid crystal polymer, epoxy-based Build-Up Film, polytetrafluoroethylene, a ceramic, and a metal oxide. 
     
     
         14 . The component carrier as set forth in  claim 1 , wherein the component carrier is configured as one of the group consisting of a printed circuit board and a substrate. 
     
     
         15 . The component carrier as set forth in  claim 1 , wherein the layer stack comprises an electrically conductive material which comprises at least one of the group consisting of copper, aluminum, nickel, silver, gold, palladium, and tungsten, any of the mentioned materials being optionally coated with supra-conductive material such as graphene. 
     
     
         16 . A method for manufacturing a component carrier, the method comprising:
 providing a layer stack comprising at least one component carrier material;   forming a photoimageable dielectric layer structure on the layer stack;   forming a spatial pattern of an electrically conductive layer structure on the photoimageable dielectric layer structure, wherein the spatial pattern comprises openings formed within the electrically conductive layer structure;   exposing the photoimageable dielectric layer structure to electromagnetic radiation, wherein the spatial pattern of the electrically conductive layer structure represents a mask for selectively exposing predefined regions of the photoimageable dielectric layer structure; and   selectively removing material from the photoimageable dielectric layer depending on the spatial pattern.   
     
     
         17 . The method as set forth in  claim 16 , wherein the layer stack, the photoimageable dielectric layer structure, and the electrically conductive layer structure are assembled together by a lamination procedure. 
     
     
         18 . The method as set forth in  claim 16 , further comprising:
 forming an electrically conductive material within the at least one recess and/or on the electrically conductive layer structure.