Mechanically Robust Component Carrier With Rigid and Flexible Portions

Abstract

A component carrier with a rigid portion, a flexible portion, a cavity defining the flexible portion next to the rigid portion, and at least one step in a transition portion between the rigid portion and the flexible portion in the cavity is disclosed.

1 . A component carrier, comprising:
 a rigid portion;   a flexible portion;   a cavity defining the flexible portion next to the rigid portion, wherein the cavity has a substantially rectangular cross-section with corners; and   at least one step in a transition portion between the rigid portion and the flexible portion in the cavity;   wherein the at least one step is formed only in a corner region of at least one of the corners.   
     
     
         2 . The component carrier according to  claim 1 , wherein the rigid portion has a larger thickness than the flexible portion. 
     
     
         3 . The component carrier according to  claim 1 , wherein the rigid portion and the flexible portion each comprise at least one electrically insulating layer structure and share a common electrically insulating layer structure. 
     
     
         4 . The component carrier according to  claim 3 , wherein the at least one electrically insulating layer structure of the rigid portion and the at least one electrically insulating layer structure of the flexible portion are made of material having the same value of the Young modulus. 
     
     
         5 . The component carrier according to  claim 3 , wherein the at least one electrically insulating layer structure of the rigid portion and the at least one electrically insulating layer structure of the flexible portion comprise resin with reinforcing glass particles. 
     
     
         6 . (canceled) 
     
     
         7 . The component carrier according to  claim 1 , wherein the flexible portion is one of the group consisting of a fully flexible portion, and a semi-flexible portion. 
     
     
         8 . The component carrier according to  claim 7 , wherein the fully flexible portion comprises or consists of at least one of the group consisting of polyimide, polyamide, and liquid crystal polymer. 
     
     
         9 . The component carrier according to  claim 7 , wherein the semi-flexible portion comprises or consists of at least one of the group consisting of FR4, and Resin Coated Copper. 
     
     
         10 . The component carrier according to  claim 1 , wherein a width of the at least one step is at least 20 μm in a horizontal direction. 
     
     
         11 . The component carrier according to  claim 1 , further comprising at least one of the following features:
 wherein a height of the at least one step is at least 20 μm in a vertical direction;   wherein the at least one step is formed at least partially by a cured low-flow prepreg layer or a cured no-flow prepreg layer in the transition portion;   wherein the at least one step forms a convex protrusion extending from at least one corner of the cavity into the cavity;   wherein the at least one step forms an undercut in at least one corner of the cavity;   wherein the flexible portion is arranged between different sections of the rigid portion;   wherein the at least one step is configured as one of the group consisting of a single step, and a double step.   
     
     
         12 . The component carrier according to  claim 1 , further comprising at least one of the following features:
 at least one electrically conductive layer structure comprising at least one of the group consisting of copper, aluminum, nickel, silver, gold, palladium, and tungsten, any of the mentioned materials being optionally coated with supra-conductive material such as graphene;   at least one electrically insulating layer structure comprising at least one of the group consisting of resin, reinforced or non-reinforced resin, epoxy resin or Bismaleimide-Triazine resin, FR-4, FR-5, cyanate ester, polyphenylene derivate, glass, prepreg material, polyimide, polyamide, liquid crystal polymer, epoxy-based Build-Up Film, polytetrafluoroethylene, a ceramic, and a metal oxide;   at least one component mounted on or embedded in the component carrier, wherein the at least one component is selected from a group consisting of an electronic component, an electrically non-conductive and/or electrically conductive inlay, a heat transfer unit, an energy harvesting unit, an active electronic component, a passive electronic component, an electronic chip, a storage device, a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a voltage converter, a cryptographic component, a transmitter and/or receiver, an electromechanical transducer, an actuator, a microelectromechanical system, a microprocessor, a capacitor, a resistor, an inductance, an accumulator, a switch, a camera, an antenna, a magnetic element, a light guiding element, a further component carrier and a logic chip;   the component carrier is shaped as a plate;   the component carrier is configured as a printed circuit board, or a substrate.   
     
     
         13 . A method of manufacturing a component carrier, the method, comprising:
 forming a stack having a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures;   forming a cavity in the stack to thereby delimit a flexible portion from a rigid portion, wherein the cavity has a substantially rectangular cross-section with corners; and   forming at least one step in the cavity in a transition portion between the rigid portion and the flexible portion;   wherein the at least one step is formed only in a corner region of at least one of the corners.   
     
     
         14 . The method according to  claim 13 , further comprising:
 forming the cavity by removing material of the stack by milling.   
     
     
         15 . The method according to  claim 13 , further comprising:
 defining the at least one step by correspondingly positioning a milling tool for removing material of the stack for forming the cavity.   
     
     
         16 . The method according to  claim 13 , wherein forming the stack is accomplished by:
 arranging an uncured layer structure between a first fully cured layer structure and a second fully cured layer structure; and   thereafter curing the uncured layer structure.   
     
     
         17 . The method according to  claim 16 , wherein the first fully cured layer structure has a stepped profile with a central protrusion surrounded by a lateral base and an indentation between the central protrusion and the base. 
     
     
         18 . The method according to  claim 17 , wherein the uncured layer structure is a patterned layer with a central recess extending to laterally surround the protrusion and the indentation and to accommodate the protrusion. 
     
     
         19 . The method according to  claim 17 , further comprising:
 forming the cavity by removing material substantially laterally inside of the indentation.   
     
     
         20 . The method according to  claim 19 , wherein removing material substantially laterally inside of the indentation comprises cutting substantially around the indentation and taking out a piece of material defined laterally by a corresponding cutting line and horizontally by a direct interface between the first fully cured layer structure and the second fully cured layer structure.