Hermetic lid seal printing method

Abstract

A method is provided. The method includes one or more of securing a die into a cavity of a hermetic package base, providing one or more bond connections to the die, placing a hermetic package lid on the package base, and 3D printing, by a 3D printer, hermetic lid seal material to a joint between the hermetic package base and the hermetic package lid, at a temperature at or below 100 degrees Celsius.

1 . A method, comprising:
 securing a die into a cavity of a hermetic package base;   providing one or more bond connections to the die;   placing a hermetic package lid on the package base; and   3D printing, by a 3D printer, hermetic lid seal material to a joint between the hermetic package base and the hermetic package lid, at a temperature at or below 100 degrees Celsius.   
     
     
         2 . The method as recited in  claim 1 , further comprising:
 clamping the hermetic package lid to the hermetic package base prior to 3D printing hermetic lid seal material.   
     
     
         3 . The method as recited in  claim 1 , wherein the die comprises a device that may be damaged at temperatures over 300 degrees Celsius, wherein the hermetic lid seal material is a hermetic compound. 
     
     
         4 . The method as recited in  claim 3 , wherein the hermetic package base comprises one of ceramic, metal, or glass, wherein the hermetic package lid comprises one of ceramic, metal, or glass. 
     
     
         5 . The method as recited in  claim 4 , wherein the hermetic package base material is different than the hermetic package lid material. 
     
     
         6 . The method as recited in  claim 3 , wherein the hermetic lid seal material comprises zinc oxide. 
     
     
         7 . The method as recited in  claim 3 , wherein the lid seal material is 3D printed in liquid form. 
     
     
         8 . The method as recited in  claim 3 , wherein the 3D printer applies the hermetic lid seal material by a selective laser sintering process, the selective laser sintering process comprising:
 3D printing, by a 3D printer, the lid seal material in powder form to a joint between the hermetic package lid and the hermetic package base; and   melting the lid seal material, by a laser, to form a hermetic bond between the hermetic package lid and the hermetic package base.   
     
     
         9 . The method as recited in  claim 3 , further comprising:
 maintaining a die temperature of less than 100 degrees Celsius while 3D printing one or more of the lid seal material or the hermetic overcoat.   
     
     
         10 . The method as recited in  claim 3 , further comprising:
 3D printing the lid seal material within an inert gas environment.   
     
     
         11 . A method, comprising:
 securing a die into a cavity of a hermetic package base;   providing one or more bond connections to the die;   placing a hermetic package lid on the hermetic package base;   3D printing, by a 3D printer, lid seal material to a joint between the hermetic package base and the hermetic package lid, at a temperature at or below 100 degrees Celsius; and   3D printing a hermetic overcoat over the lid seal material, the hermetic overcoat completely covering the lid seal material.   
     
     
         12 . The method as recited in  claim 11 , further comprising:
 clamping the hermetic package lid to the hermetic package base prior to 3D printing lid seal material.   
     
     
         13 . The method as recited in  claim 11 , wherein the die comprises a device that may be damaged at temperatures over 300 degrees Celsius, wherein the hermetic overcoat material is a hermetic compound. 
     
     
         14 . The method as recited in  claim 13 , wherein the hermetic package base comprises one of ceramic, metal, or glass, wherein the hermetic package lid comprises one of ceramic, metal, or glass. 
     
     
         15 . The method as recited in  claim 14 , wherein the hermetic package base material is different than the hermetic package lid material. 
     
     
         16 . The method as recited in  claim 13 , wherein the hermetic lid seal material comprises zinc oxide. 
     
     
         17 . The method as recited in  claim 13 , wherein at least the lid seal material is 3D printed in liquid form. 
     
     
         18 . The method as recited in  claim 13 , wherein the 3D printer applies one or more of the lid seal material and the hermetic overcoat by a selective laser sintering process, the selective laser sintering process comprising:
 3D printing, by a 3D printer, one or more of the lid seal material and hermetic overcoat material in powder form to a joint between the hermetic package lid and the hermetic package base; and   melting, by a laser, one or more of the lid seal material and hermetic overcoat material to form a hermetic bond between the hermetic package lid and the hermetic package base.   
     
     
         19 . The method as recited in  claim 13 , further comprising:
 maintaining a die temperature of less than 100 degrees Celsius while 3D printing the lid seal material and the hermetic overcoat.   
     
     
         20 . The method as recited in  claim 13 , further comprising:
 3D printing the lid seal material within a noble gas environment; and   3D printing the hermetic overcoat within a noble gas environment, in response to 3D printing a non-hermetic lid seal material.