Assignee
SPORY ERICK MERLE
US·12 granted patents·1 pending application·17 citations·filing 2013–2019
Top patents by PatentIndex Score
13 records- 0189US9870968B2Repackaged integrated circuit and assembly methodSPORY ERICK MERLE·Filed 2016·Granted Jan 16, 2018·9 cites·12 claims
- 0278US10654259B2Conductive diamond application methodSPORY ERICK MERLE·Filed 2017·Granted May 19, 2020·1 cites·10 claims
- 0375US10460326B2Counterfeit integrated circuit detection by comparing integrated circuit signature to reference signatureSPORY ERICK MERLE·Filed 2017·Granted Oct 29, 2019·2 cites·16 claims
- 0474US10002846B2Method for remapping a packaged extracted die with 3D printed bond connectionsSPORY ERICK MERLE·Filed 2017·Granted Jun 19, 2018·2 cites·20 claims
- 0570US10431510B2Hermetic lid seal printing methodSPORY ERICK MERLE·Filed 2018·Granted Oct 1, 2019·1 cites·20 claims
- 0667US10115645B1Repackaged reconditioned die method and assemblySPORY ERICK MERLE·Filed 2018·Granted Oct 30, 2018·1 cites·20 claims
- 0762US9966319B1Environmental hardening integrated circuit method and apparatusSPORY ERICK MERLE·Filed 2013·Granted May 8, 2018·1 cites·9 claims
- 0852US2020020602A1Hermetic lid seal printing methodSPORY ERICK MERLE·Filed 2019·Application pending·0 cites
- 0949US10177056B2Repackaged integrated circuit assembly methodSPORY ERICK MERLE·Filed 2017·Granted Jan 8, 2019·0 cites·20 claims
- 1046US10177054B2Method for remapping a packaged extracted dieSPORY ERICK MERLE·Filed 2017·Granted Jan 8, 2019·0 cites·20 claims
- 1146US10109606B2Remapped packaged extracted dieSPORY ERICK MERLE·Filed 2017·Granted Oct 23, 2018·0 cites·20 claims
- 1244US10147660B2Remapped packaged extracted die with 3D printed bond connectionsSPORY ERICK MERLE·Filed 2017·Granted Dec 4, 2018·0 cites·19 claims
- 1344US10128161B23D printed hermetic package assembly and methodSPORY ERICK MERLE·Filed 2017·Granted Nov 13, 2018·0 cites·20 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →