Apparatus and method for processing substrate

Abstract

Embodiments of the inventive concept described herein relate to an apparatus and method for removing an adhesive exposed to the outside from an object being processed. The apparatus for removing the adhesive exposed to the outside from an edge region of the object being processed, in which the object has a patterned substrate and a support plate bonded together by the adhesive. The cover liquid nozzle dispenses the cover liquid onto a cover area of a top surface of the object other than the exposed area, and the controller controls the cover liquid dispensing member to adjust a flow rate of the cover liquid to cause a removal rate of the adhesive to remain constant.

What is claimed is: 
     
         1 . An apparatus for removing an adhesive exposed to the outside from an edge region of an object being processed, wherein the object has a patterned substrate and a support plate bonded together by the adhesive, the apparatus comprising:
 a support unit configured to support and rotate the object;   a liquid dispensing unit configured to dispense a liquid onto the object, which is supported on the support unit, to remove the exposed adhesive on the object; and   a controller configured to control the liquid dispensing unit,   wherein the support plate has a larger diameter than the substrate, and an exposed area where the adhesive is exposed includes an area between a lateral end of the substrate and a lateral end of the support plate,   wherein the liquid dispensing unit includes:   a processing liquid dispensing member having a processing liquid nozzle configured to dispense a processing liquid onto the exposed area; and   a cover liquid dispensing member having a cover liquid nozzle configured to dispense a cover liquid that protects the substrate from the processing liquid,   wherein the cover liquid nozzle dispenses the cover liquid onto a cover area of a top surface of the object other than the exposed area, and   wherein the controller controls the cover liquid dispensing member to adjust a flow rate of the cover liquid to cause a removal rate of the adhesive to remain constant.   
     
     
         2 . The apparatus of  claim 1 , wherein the cover liquid nozzle dispenses the cover liquid at a first flow rate or a second flow rate higher than the first flow rate, and
 wherein the controller controls the cover liquid dispensing member to alternately dispense the cover liquid at the first flow rate and the second flow rate.   
     
     
         3 . The apparatus of  claim 2 , wherein the cover area includes a central area of the object, and
 wherein the exposed area surrounds the cover area.   
     
     
         4 . The apparatus of  claim 3 , wherein the processing liquid dispensing member further includes an upper heater configured to heat the processing liquid to a process temperature higher than room temperature, and
 wherein the cover liquid dispensing member further includes a cooler configured to cool the cover liquid to a cooling temperature lower than the process temperature.   
     
     
         5 . The apparatus of  claim 4 , wherein a discharge opening of the processing liquid nozzle is downwardly inclined toward the outside of the object. 
     
     
         6 . The apparatus of  claim 1 , wherein the cover liquid includes a liquid that dilutes the processing liquid. 
     
     
         7 . The apparatus of  claim 6 , wherein the liquid dispensing unit further includes an adjustment liquid dispensing member configured to dispense an adjustment liquid onto a bottom surface of the object,
 wherein the adjustment liquid dispensing member includes:   an adjustment liquid nozzle configured to dispense the adjustment liquid onto a bottom surface of the support plate; and   a lower heater configured to heat the adjustment liquid to a heating temperature higher than the room temperature, and   wherein the controller controls the lower heater to adjust the heating temperature to prevent a temperature of the support plate from being lowered to a predetermined temperature or less.   
     
     
         8 . The apparatus of  claim 7 , wherein the controller controls the adjustment liquid dispensing member to cause the adjustment liquid to have a higher flow rate than the cover liquid. 
     
     
         9 . A method for removing an adhesive exposed from an object being processed, wherein the object has a patterned substrate and a support plate bonded together by the adhesive, the method comprising:
 removing the adhesive by dispensing a processing liquid onto an exposed area where the adhesive is exposed, while rotating the object, wherein the support plate has a larger diameter than the substrate, and the support plate and the substrate are rotated in a state of having the same center; and   protecting the substrate from the processing liquid by dispensing a cover liquid onto a cover area of a top surface of the object other than the exposed area, wherein a flow rate of the cover liquid is adjusted to cause a removal rate of the adhesive to remain constant.   
     
     
         10 . The method of  claim 9 , wherein the cover liquid is dispensed at a first flow rate or a second flow rate higher than the first flow rate, and
 wherein the cover liquid is alternately dispensed at the first flow rate and the second flow rate.   
     
     
         11 . The method of  claim 10 , wherein the processing liquid has a process temperature higher than room temperature, and
 wherein the cover liquid has a cooling temperature lower than the process temperature.   
     
     
         12 . The method of  claim 9 , wherein the cover liquid includes a liquid that dilutes the processing liquid. 
     
     
         13 . The method of  claim 12 , wherein the processing liquid includes a chemical having a property of an acid or a alkali, and
 wherein the cover liquid includes deionized water.   
     
     
         14 . The method of  claim 12 , wherein an adjustment liquid is dispensed onto a bottom surface of the support plate to adjust a temperature of the support plate while the processing liquid and the cover liquid are being dispensed onto the top surface of the object, and
 wherein the adjustment liquid has a higher temperature than the cover liquid.   
     
     
         15 . The method of  claim 14 , wherein the adjustment liquid is dispensed at a higher flow rate than the cover liquid.