Apparatus and method for processing substrate
Abstract
The inventive concept relates to an apparatus for processing a substrate. In an embodiment, the apparatus includes a process chamber having a processing space inside, a support unit that supports the substrate in the processing space, a gas supply unit that supplies a process gas into the processing space, and a plasma source that generates plasma from the process gas. The support unit includes a support on which the substrate is placed, an edge ring around the substrate placed on the support, an impedance adjustment member provided below the edge ring, and a temperature adjustment member that variably adjusts temperature of the impedance adjustment member.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An apparatus for processing a substrate, the apparatus comprising:
a process chamber having a processing space inside; a support unit configured to support the substrate in the processing space; a gas supply unit configured to supply a process gas into the processing space; and a plasma source configured to generate plasma from the process gas, wherein the support unit comprises: a support on which the substrate is placed; an edge ring configured to surround the substrate placed on the support; an impedance adjustment member provided below the edge ring; and a temperature adjustment member configured to variably adjust temperature of the impedance adjustment member.
2 . The apparatus of claim 1 , wherein the impedance adjustment member is made of a material, the dielectric constant of which varies according to temperature.
3 . The apparatus of claim 2 , further comprising:
a controller configured to control the temperature adjustment member, wherein the controller controls the temperature adjustment member to change the dielectric constant of the impedance adjustment member as a amount of corrosion of the edge ring increases.
4 . The apparatus of claim 3 , wherein the controller controls the temperature adjustment member to increase the dielectric constant of the impedance adjustment member as the amount of corrosion of the edge ring increases.
5 . The apparatus of claim 3 , wherein the apparatus further comprises a corrosion measurement member configured to measure the amount of corrosion of the edge ring, and
wherein the controller receives the amount of corrosion measured by the corrosion measurement member.
6 . The apparatus of claim 1 , wherein the impedance adjustment member is formed of a dielectric substance containing magnesium oxide.
7 . The apparatus of claim 6 , wherein the dielectric substance contains 10 wt % to 50 wt % of magnesium oxide.
8 . The apparatus of claim 1 , further comprising:
a controller configured to control the temperature adjustment member, wherein the controller controls temperature of the temperature adjustment member, based on a amount of corrosion of the edge ring.
9 . The apparatus of claim 1 , wherein the impedance adjustment member has the highest dielectric constant at a first temperature, an increasing dielectric constant with a temperature rise in a range below the first temperature, and a decreasing dielectric constant with a temperature rise in a range above the first temperature, and
wherein the controller controls the temperature adjustment member to raise the temperature of the impedance adjustment member in the range below the first temperature and lower the temperature of the impedance adjustment member in the range above the first temperature, when a amount of corrosion of the edge ring increases.
10 . The apparatus of claim 1 , wherein the impedance adjustment member has a ring shape with an upper surface that corresponds to a shape of a lower portion of the edge ring.
11 . A method for processing a substrate, the method comprising:
processing the substrate by supplying plasma onto the substrate placed on a support; and controlling a plasma density above an edge ring by adjusting a dielectric constant of an impedance adjustment member placed below the edge ring, the edge ring being configured to surround a side of the substrate placed on the support.
12 . The method of claim 11 , further comprising:
variably adjusting the dielectric constant of the impedance adjustment member, based on a amount of corrosion of the edge ring.
13 . The method of claim 11 , wherein the impedance adjustment member is formed of a dielectric substance containing magnesium oxide.
14 . The method of claim 13 , wherein the dielectric substance contains 10 wt % to 50 wt % of magnesium oxide.
15 . The method of claim 11 , further comprising:
controlling temperature to increase the dielectric constant of the impedance adjustment member as a amount of corrosion of the edge ring increases.
16 . The method of claim 11 , wherein the impedance adjustment member has the highest dielectric constant at a first temperature, an increasing dielectric constant with a temperature rise in a range below the first temperature, and a decreasing dielectric constant with a temperature rise in a range above the first temperature, and
wherein temperature of the impedance adjustment member is raised in the range below the first temperature and lowered in the range above the first temperature when a amount of corrosion of the edge ring increases.
17 . The method of claim 11 , further comprising:
measuring a amount of corrosion of the edge ring; and changing the dielectric constant of the impedance adjustment member according to the measured amount of corrosion.
18 . The method of claim 11 , further comprising:
changing the dielectric constant of the impedance adjustment member according to cumulative substrate processing time.
19 . The method of claim 11 , further comprising:
changing the dielectric constant of the impedance adjustment member according to the number of substrates processed.Join the waitlist — get patent alerts
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