Thermal module

Abstract

A thermal module includes a vapor chamber (1) and a cooling plate (2) placed on a surface (100) of the vapor chamber (1). The cooling plate (2) includes a board (20) and a half-pipe member (21). The board (20) has a combination surface (200) and a cooling surface (201), the combination surface (200) is attached to the vapor chamber (1), and the half-pipe member (21) is integrally formed with the board (20) on its cooling surface (201). The half-pipe member (21) is recessed into the combination surface (200) of the board (20) and protruded from the cooling surface (201). Therefore, the half-pipe member (21) can improve heat dissipation, and the board (20) is in face-to-face contact with the vapor chamber (1) to provide a good sealing effect and facilitate easy production.

1 . A thermal module, comprising:
 a vapor chamber ( 1 ) including two surfaces ( 100 ), ( 110 ); and   a cooling plate ( 2 ) disposed on one surface ( 100 ) of the two surfaces ( 100 ), ( 110 ) of the vapor chamber ( 1 ), the cooling plate ( 2 ) integrally formed with a board ( 20 ) and a half-pipe member ( 21 ), the board ( 20 ) including a combination surface ( 200 ) and a cooling surface ( 201 ), the combination surface ( 200 ) of the board ( 20 ) being attached onto the vapor chamber ( 1 ), the half-pipe member ( 21 ) being integrally formed with the board ( 20 ) on its cooling surface ( 201 ), the half-pipe member ( 21 ) being recessed into the combination surface ( 200 ) of the board ( 20 ) and protruded from the cooling surface ( 201 ),   wherein the vapor chamber ( 1 ) includes a first plate ( 10 ) and a second plate ( 11 ), the first plate ( 10 ) and the second plate ( 11 ) are superposed on each other to form a rectangle-shaped accommodating space ( 12 ).   
     
     
         2 . The thermal module according to  claim 1 , wherein the combination surface ( 200 ) of the board ( 20 ) is attached in face-to-face contact relationship to the surface ( 100 ) on which the cooling plate ( 2 ) is disposed. 
     
     
         3 . The thermal module according to  claim 1 , wherein the half-pipe member ( 21 ) on the board ( 20 ) is bent in a turning configuration. 
     
     
         4 . The thermal module according to  claim 1 , wherein a channel ( 210 ) is formed between the half-pipe member ( 21 ) and the surface ( 100 ) on which the cooling plate ( 2 ) is disposed. 
     
     
         5 . The thermal module according to  claim 4 , wherein the channel ( 210 ) includes a first end port ( 211 ) and a second end port ( 212 ), and the first end port ( 211 ) communicates with the second end port ( 212 ) by means of the half-pipe member ( 21 ) extending on the cooling surface ( 201 ). 
     
     
         6 . The thermal module according to  claim 5 , wherein the first end port ( 211 ) and the second end port ( 212 ) are at the same side, opposite sides or adjacent sides of the board ( 20 ). 
     
     
         7 . The thermal module according to  claim 5 , wherein the first end port ( 211 ) and the second end port ( 212 ) are each connected to a pipe joint ( 3 ). 
     
     
         8 . The thermal module according to  claim 1 , wherein the accommodating space ( 12 ) are sealed by the first plate ( 10 ) and the second plate ( 11 ) to be in a vacuum state. 
     
     
         9 . The thermal module according to  claim 8 , wherein the surface ( 100 ) of the vapor chamber ( 1 ), on which the cooling plate ( 2 ) is disposed, is formed on an exterior surface of the first plate ( 10 ), and the other surface ( 110 ) of the vapor chamber ( 1 ) is formed on an exterior surface of the second plate ( 11 ). 
     
     
         10 . The thermal module according to  claim 9 , wherein a working fluid is filled in the accommodating space ( 12 ), and a capillary tissue portion ( 13 ) is attached onto an inner surface of the accommodating space ( 12 ).