Method for the Production of an Electronic Module Having an Electronic Component Embedded Therein

Abstract

An electronic module and method for the production of the electronic module in accordance with some embodiments of the invention are disclosed. The electronic module includes at least one electronic component affixed to a conductive layer by means of sticky electrically insulating layer, where the electronic component is embedded in a transparent foil. The electronic module is produces by providing an electrically conductive layer. At least one electronic component is affixed to the electrically conductive layer by means of a sticky electrically insulating layer and embedded in a transparent foil. The at least one electronic component is electronically contacted with the conductive layer.

What is claimed is: 
     
         1 . An electronic module comprising at least one electronic component affixed to a conductive layer by means of sticky electrically insulating layer, the electronic component being embedded in a transparent foil. 
     
     
         2 . An electronic module according to  claim 1 , characterized in that the electronic component is chosen from the group consisting of a light-emitting diode (LED), a laser-diode, a photo-diode, a photographic sensor, a photonic chip and a proximity sensor. 
     
     
         3 . An electronic module according to  claim 1 , characterized in that the electronic component is a flipchip-component. 
     
     
         4 . An electronic module according  claim 1 , characterized in that a light-reflecting layer is applied to the electrically conductive layer. 
     
     
         5 . An electronic module according to  claim 1 , characterized in that the light-reflecting layer is formed by a material chosen from the group consisting of solder resist and ceramic paste. 
     
     
         6 . An electronic module according to  claim 1 , characterized in that the light-reflecting layer is formed by a layer chosen from the group consisting of a metal layer and an oxide layer. 
     
     
         7 . An electronic module according to  claim 1 , characterized in that the transparent foil is an ethylene-vinyl acetate-foil. 
     
     
         8 . An electronic module according to  claim 1 , characterized in that the transparent foil is covered with a protective layer in form of a glass-plate. 
     
     
         9 . An electronic module according to  claim 1 , characterized in that the transparent foil is structured to relief-like surface-structures.