Embedding Component in Component Carrier by Component Fixation Structure

Abstract

A method of manufacturing a component carrier, wherein the method comprises covering a main surface of a base structure at least partially by a component fixation structure, mounting a component on a carrier, and inter-connecting the base structure with the carrier so that the component extends partially into the component fixation structure.

1 . A method of manufacturing a component carrier, wherein the method comprises:
 covering a main surface of a base structure at least partially by a component fixation structure;   mounting a component on a carrier;   interconnecting the base structure with the carrier so that the component extends partially into the component fixation structure.   
     
     
         2 . The method according to  claim 1 , wherein the carrier is a temporary carrier which is removed before completing manufacture of the component carrier. 
     
     
         3 . The method according to  claim 1 , wherein the main surface of the base structure is covered at least partly with an at least partially uncured material as the component fixation structure. 
     
     
         4 . The method according to  claim 1 , wherein the component fixation structure comprises at least one of the group consisting of resin, in particular epoxy resin or Bismaleimide-Triazine resin, prepreg, cyanate ester, polyimide, acrylate, and prepreg. 
     
     
         5 . The method according to  claim 1 , wherein the component fixation structure has a thickness in a range between 2 μm and 50 μm, in particular in a range between 5 μm and 20 μm. 
     
     
         6 . The method according to  claim 1 , wherein the base structure is made of a fully cured material. 
     
     
         7 . The method according to  claim 1 , wherein the base structure comprises at least one of the group consisting of a core, a stack comprising at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, and a metal foil. 
     
     
         8 . The method according to  claim 1 , wherein the method comprises at least partially removing warpage of the component by mounting, in particular adhering, the component on the carrier. 
     
     
         9 . The method according to  claim 1 , wherein the interconnecting is carried out by one of the group consisting of laminating, and adhering. 
     
     
         10 . The method according to  claim 1 , wherein the method comprises:
 covering an opposing another main surface of the base structure at least partially by a further component fixation structure;   mounting a further component on a further carrier;   interconnecting the base structure with the further carrier so that the further component extends partially into the further component fixation structure.   
     
     
         11 . The method according to  claim 1 , wherein the method comprises:
 forming at least one contact hole in the base structure before the covering with the component fixation structure;   filling the at least one contact hole at least partially with electrically conductive material after the interconnecting.   
     
     
         12 . The method according to  claim 1 , wherein the method comprises forming the component fixation structure selectively only on a portion of the main surface of the base structure, in particular by transferring material of the component fixation structure onto the main surface of the base structure from an auxiliary body by a transfer body having at least one elevated section corresponding to the portion of the main surface of the base structure to be selectively covered with the component fixation structure. 
     
     
         13 . The method according to  claim 1 , comprising at least one of the following features:
 wherein the method comprises mounting the component on a flat carrier, in particular on a cavity-free carrier;   wherein the method comprises re-melting and subsequently re-solidifying material of the component fixation structure during the interconnecting so that the component is integrally fixed with the component fixation structure;   wherein the method comprises pressing the component partially into the component fixation structure and simultaneously and/or subsequently curing the component fixation structure so that the component is permanently immobilized within the cured component fixation structure;   wherein the method comprises flipping the carrier with the component mounted thereon before the interconnecting with the base structure covered with the component fixation structure.   
     
     
         14 . A semifinished product for manufacturing a component carrier, wherein the semifinished product comprises:
 a base structure at least partially covered by a component fixation structure;   a carrier with a component mounted thereon;   wherein the base structure is interconnected or is to be interconnected with the carrier so that the component extends partially into the component fixation structure.   
     
     
         15 . The semifinished product according to  claim 14 , wherein the component is at least partially arranged in a cavity of the base structure. 
     
     
         16 . The semifinished product according to  claim 14 , comprising at least one of the following features:
 the semifinished product comprises at least one electrically conductive layer structure comprising at least one of the group consisting of copper, aluminum, nickel, silver, gold, palladium, and tungsten, any of the mentioned materials being optionally coated with a supra-conductive material;   the semifinished product comprises at least one electrically insulating layer structure comprising at least one of the group consisting of resin, epoxy resin or Bismaleimide-Triazine resin, FR-4, FR-5, cyanate ester, polyphenylene derivate, glass, prepreg material, polyimide, polyamide, liquid crystal polymer, epoxy-based Build-Up Film, polytetrafluoroethylene, a ceramic, and a metal oxide;   wherein the component fixation structure comprises or consists of the same material as at least one of the base structure and the at least one electrically insulating layer structure;   wherein the component is selected from a group consisting of an electronic component, an electrically non-conductive and/or electrically conductive inlay, a heat transfer unit, an energy harvesting unit, an active electronic component, a passive electronic component, an electronic chip, a storage device, a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a voltage converter, a cryptographic component, a transmitter and/or receiver, an electromechanical transducer, an actuator, a microelectromechanical system, a microprocessor, a capacitor, a resistor, an inductance, an accumulator, a switch, a camera, an antenna, a magnetic element, a light guiding element, a further component carrier and a logic chip;   the semifinished product is shaped as a plate;   wherein the component carrier to be manufactured from the semifinished product is configured as one of the group consisting of a printed circuit board; and a substrate.   
     
     
         17 . A component carrier, comprising:
 an interconnected stack comprising at least one electrically insulating layer structure and/or at least one electrically conductive layer structure;   a component fixation structure in the stack;   a component embedded in the stack and extending partially into the component fixation structure so that a thickness of the component fixation structure under the component is smaller than a thickness of the component fixation structure laterally to the component.   
     
     
         18 . The component carrier according to  claim 17 , wherein the component carrier is warpage-free. 
     
     
         19 . The component carrier according to  claim 17 , wherein the component intrinsically comprises warpage. 
     
     
         20 . The component carrier according to  claim 17 , comprising at least one of the following features:
 the component carrier comprises a shielding structure configured for shielding electromagnetic radiation from propagating between an exterior of the component carrier and the component;   the component carrier comprises a heat removal structure configured for removing heat from the component during operation of the component carrier;   the component carrier comprises at least one further component stacked and electrically connected with the component;   wherein at least part of the interconnected stack forms a flex board section;   wherein the thickness of the component fixation structure under the component is in a range between 1 μm and 50 μm   the component carrier comprises at least one electrically conductive contact structure electrically connecting the embedded component and being configured as at least one of the group consisting of a contact hole at least partially filled with electrically conductive material and extending at least partially through the interconnected stack up to the component, and a patterned electrically conductive layer structure on or above and electrically connected with the component.