Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution

Abstract

The present disclosure is directed to a microelectronic assembly that includes first and second microelectronic elements, signal leads, one or more jumper leads, and a dielectric element that has first and second apertures. The signal leads may be connected to one or more of the microelectronic elements and extend through the one or more of the first or second apertures to conductive elements on the dielectric element. The jumper leads may extend through the first aperture and be connected to a contact of the first microelectronic element. The one or more jumper leads may span over the second aperture and be connected to a conductive element on the dielectric element.

1 . (canceled) 
     
     
         2 . A microelectronic assembly, comprising:
 a dielectric element having oppositely-facing first and second surfaces and first and second apertures extending between the surfaces, the dielectric element further having a plurality of electrically conductive elements thereon;   a first microelectronic element having a rear surface and a front surface facing the dielectric element, the first microelectronic element having a plurality of contacts exposed at the front surface thereof;   a second microelectronic element having a rear surface and a front surface facing the rear surface of the first microelectronic element, the second microelectronic element having a plurality of contacts exposed at the front surface and projecting beyond an edge of the first microelectronic element; and   signal leads connected to one or more of the microelectronic elements and extending through the one or more of the first or second apertures to some of the conductive elements on the dielectric element; and   one or more jumper leads extending through the first aperture and connected to a contact of the first microelectronic element, the one or more jumper leads spanning over the second aperture and being connected to a conductive element on the dielectric element.   
     
     
         3 . The microelectronic assembly according to  claim 2 , wherein the signal leads are wire bonds. 
     
     
         4 . The microelectronic assembly according to  claim 2 , wherein the jumper leads are wire bonds. 
     
     
         5 . A system comprising an assembly according to  claim 2 , further comprising one or more other electronic components electrically connected to the assembly. 
     
     
         6 . A system as claimed in  claim 5 , further comprising a housing, the assembly and the other electronic components being mounted to the housing. 
     
     
         7 . The microelectronic assembly of  claim 2 , further comprising a second jumper lead extending from a conductive element on one side of the first aperture, across the first aperture, across a portion of the second surface between the first and second apertures, and through the second aperture to one of the microelectronic elements. 
     
     
         8 . The microelectronic assembly of  claim 2 , wherein the plurality of contacts on the first and second microelectronic elements extend along a central region of the respective first and second microelectronic elements. 
     
     
         9 . A microelectronic assembly, comprising:
 a dielectric element having oppositely-facing first and second surfaces and first and second apertures extending between the surfaces, the dielectric element further having a plurality of electrically conductive elements thereon;   a first microelectronic element having a rear surface and a front surface facing the dielectric element, the first microelectronic element having a plurality of contacts exposed at the front surface thereof;   a second microelectronic element having a rear surface and a front surface facing the rear surface of the first microelectronic element, the second microelectronic element having a plurality of contacts exposed at the front surface and projecting beyond an edge of the first microelectronic element; and   signal leads connected to one or more of the microelectronic elements and extending through one or more of the first or second apertures to some of the conductive elements on the dielectric element; and   one or more jumper leads spanning over the first and second apertures and connected to a conductive element on the dielectric element.   
     
     
         10 . The microelectronic assembly of  claim 9 , further comprising an encapsulant disposed in the first aperture and covering the signal leads and the one or more jumper leads. 
     
     
         11 . The microelectronic assembly of  claim 9 , further comprising a second jumper lead extending from a conductive element on one side of the first aperture, across the first aperture, across a portion of the second surface between the first and second apertures, and through the second aperture to one of the microelectronic elements. 
     
     
         12 . The microelectronic assembly of  claim 11 , wherein the first and second apertures have elongated shapes and extend substantially parallel to one another. 
     
     
         13 . The microelectronic assembly of  claim 9 , wherein the electrically conductive elements on the dielectric element include terminals exposed at the second surface of the dielectric element. 
     
     
         14 . The microelectronic assembly according to  claim 9 , wherein the signal leads are wire bonds. 
     
     
         15 . The microelectronic assembly according to  claim 9 , wherein the jumper leads are wire bonds. 
     
     
         16 . A system comprising an assembly according to  claim 9 , further comprising one or more other electronic components electrically connected to the assembly. 
     
     
         17 . A system as claimed in  claim 16 , further comprising a housing, the assembly and the other electronic components being mounted to the housing. 
     
     
         18 . The microelectronic assembly of  claim 12 , wherein the first aperture and the second aperture are comprised of different dimensions. 
     
     
         19 . The microelectronic assembly according to  claim 9 , wherein the plurality of contacts on the first and second microelectronic elements extend along a central region of the respective first and second microelectronic elements.