Assignee
TESSERA INC
US·674 granted patents·109 pending applications·36,597 citations·filing 1991–2021
Top patents by PatentIndex Score
783 records- 0199US11049953B2Nanosheet transistorTESSERA INC·Filed 2020·Granted Jun 29, 2021·6 cites·21 claims
- 0299US9570382B2Stackable molded microelectronic packagesTESSERA INC·Filed 2015·Granted Feb 14, 2017·41 cites·20 claims
- 0399US9123664B2Stackable molded microelectronic packagesTESSERA INC·Filed 2014·Granted Sep 1, 2015·68 cites·15 claims
- 0499US8907466B2Stackable molded microelectronic packagesTESSERA INC·Filed 2013·Granted Dec 9, 2014·59 cites·19 claims
- 0599US8659164B2Microelectronic package with terminals on dielectric massTESSERA INC·Filed 2012·Granted Feb 25, 2014·84 cites·30 claims
- 0699US7901989B2Reconstituted wafer level stackingTESSERA INC·Filed 2008·Granted Mar 8, 2011·128 cites·16 claims
- 0799US7872344B2Microelectronic assemblies having compliant layersTESSERA INC·Filed 2006·Granted Jan 18, 2011·64 cites·21 claims
- 0899US6001671AMethods for manufacturing a semiconductor package having a sacrificial layerTESSERA INC·Filed 1996·Granted Dec 14, 1999·712 cites·44 claims
- 0999US5802699AMethods of assembling microelectronic assembly with socket for engaging bump leadsTESSERA INC·Filed 1994·Granted Sep 8, 1998·434 cites·30 claims
- 1099US5679977ASemiconductor chip assemblies, methods of making same and components for sameTESSERA INC·Filed 1993·Granted Oct 21, 1997·575 cites·27 claims
- 1199US5659952AMethod of fabricating compliant interface for semiconductor chipTESSERA INC·Filed 1994·Granted Aug 26, 1997·491 cites·48 claims
- 1299US5590460AMethod of making multilayer circuitTESSERA INC·Filed 1994·Granted Jan 7, 1997·172 cites·34 claims
- 1399US5518964AMicroelectronic mounting with multiple lead deformation and bondingTESSERA INC·Filed 1994·Granted May 21, 1996·659 cites·49 claims
- 1499US5455390AMicroelectronics unit mounting with multiple lead bondingTESSERA INC·Filed 1994·Granted Oct 3, 1995·407 cites·23 claims
- 1599US5347159ASemiconductor chip assemblies with face-up mounting and rear-surface connection to substrateTESSERA INC·Filed 1991·Granted Sep 13, 1994·351 cites·27 claims
- 1699US5258330ASemiconductor chip assemblies with fan-in leadsTESSERA INC·Filed 1993·Granted Nov 2, 1993·222 cites·16 claims
- 1798US11056429B2Semiconductor device including a porous dielectric layer, and method of forming the semiconductor deviceTESSERA INC·Filed 2020·Granted Jul 6, 2021·4 cites·19 claims
- 1898US11043581B2Nanosheet channel-to-source and drain isolationTESSERA INC·Filed 2020·Granted Jun 22, 2021·4 cites·11 claims
- 1998US9224717B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2014·Granted Dec 29, 2015·76 cites·20 claims
- 2098US9153562B2Stacked packaging improvementsTESSERA INC·Filed 2014·Granted Oct 6, 2015·60 cites·17 claims
- 2198US9093435B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2013·Granted Jul 28, 2015·68 cites·23 claims
- 2298US8927337B2Stacked packaging improvementsTESSERA INC·Filed 2013·Granted Jan 6, 2015·76 cites·18 claims
- 2398US8378478B2Enhanced stacked microelectronic assemblies with central contacts and vias connected to the central contactsTESSERA INC·Filed 2010·Granted Feb 19, 2013·48 cites·26 claims
- 2498US8022527B2Edge connect wafer level stackingTESSERA INC·Filed 2010·Granted Sep 20, 2011·44 cites·17 claims
- 2598US7939934B2Microelectronic packages and methods thereforTESSERA INC·Filed 2005·Granted May 10, 2011·87 cites·45 claims
- 2698US7911805B2Multilayer wiring element having pin interfaceTESSERA INC·Filed 2007·Granted Mar 22, 2011·78 cites·36 claims
- 2798US7768574B2Compact lens turret assemblyTESSERA INC·Filed 2005·Granted Aug 3, 2010·95 cites·20 claims
- 2898US7495179B2Components with posts and padsTESSERA INC·Filed 2005·Granted Feb 24, 2009·70 cites·14 claims
- 2998US7453157B2Microelectronic packages and methods thereforTESSERA INC·Filed 2005·Granted Nov 18, 2008·101 cites·36 claims
- 3098US7408260B2Microelectronic assemblies having compliant layersTESSERA INC·Filed 2006·Granted Aug 5, 2008·52 cites·23 claims
- 3198US7176506B2High frequency chip packages with connecting elementsTESSERA INC·Filed 2003·Granted Feb 13, 2007·320 cites·18 claims
- 3298US6847101B2Microelectronic package having a compliant layer with bumped protrusionsTESSERA INC·Filed 2002·Granted Jan 25, 2005·129 cites·47 claims
- 3398US6774317B2Connection components with postsTESSERA INC·Filed 2002·Granted Aug 10, 2004·93 cites·11 claims
- 3498US6765288B2Microelectronic adaptors, assemblies and methodsTESSERA INC·Filed 2002·Granted Jul 20, 2004·156 cites·41 claims
- 3598US6699730B2Stacked microelectronic assembly and method thereforTESSERA INC·Filed 2001·Granted Mar 2, 2004·366 cites·33 claims
- 3698US6586955B2Methods and structures for electronic probing arraysTESSERA INC·Filed 2001·Granted Jul 1, 2003·137 cites·65 claims
- 3798US6583444B2Semiconductor packages having light-sensitive chipsTESSERA INC·Filed 1998·Granted Jun 24, 2003·270 cites·6 claims
- 3898US6465893B1Stacked chip assemblyTESSERA INC·Filed 2000·Granted Oct 15, 2002·152 cites·66 claims
- 3998US6313528B1Compliant multichip packageTESSERA INC·Filed 2000·Granted Nov 6, 2001·232 cites·13 claims
- 4098US6294830B1Microelectronic assembly with conductive terminals having an exposed surface through a dielectric layerTESSERA INC·Filed 1999·Granted Sep 25, 2001·302 cites·9 claims
- 4198US6225688B1Stacked microelectronic assembly and method thereforTESSERA INC·Filed 1999·Granted May 1, 2001·472 cites·18 claims
- 4298US6211572B1Semiconductor chip package with fan-in leadsTESSERA INC·Filed 1996·Granted Apr 3, 2001·282 cites·21 claims
- 4398US6202297B1Socket for engaging bump leads on a microelectronic device and methods thereforTESSERA INC·Filed 1998·Granted Mar 20, 2001·208 cites·8 claims
- 4498US6194291B1Microelectronic assemblies with multiple leadsTESSERA INC·Filed 1999·Granted Feb 27, 2001·182 cites·14 claims
- 4598US6177636B1Connection components with postsTESSERA INC·Filed 1997·Granted Jan 23, 2001·305 cites·7 claims
- 4698US5810609ASocket for engaging bump leads on a microelectronic device and methods thereforTESSERA INC·Filed 1995·Granted Sep 22, 1998·167 cites·26 claims
- 4798US5801441AMicroelectronic mounting with multiple lead deformation and bondingTESSERA INC·Filed 1995·Granted Sep 1, 1998·245 cites·16 claims
- 4898US5632631AMicroelectronic contacts with asperities and methods of making sameTESSERA INC·Filed 1994·Granted May 27, 1997·280 cites·13 claims
- 4998US5536909ASemiconductor connection components and methods with releasable lead supportTESSERA INC·Filed 1994·Granted Jul 16, 1996·254 cites·27 claims
- 5098US5282312AMulti-layer circuit construction methods with customization featuresTESSERA INC·Filed 1991·Granted Feb 1, 1994·248 cites·20 claims
Showing the top 50 of 783 patent records by PatentIndex Score.
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