Connection Component with Posts and Pads

Abstract

A packaged microelectronic element includes connection component incorporating a dielectric layer ( 22 ) carrying traces ( 58 ) remote from an outer surface ( 26 ), posts ( 48 ) extending from the traces and projecting beyond the outer surface of the dielectric, and pads ( 30 ) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts ( 74 ) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads ( 76 ) such as wire bonds. Methods of making the connection component are also disclosed.

1 - 27 . (canceled) 
     
     
         28 . A connection component comprising:
 a first conductive layer having portions in accordance with a predetermined pattern;   a reinforced dielectric layer;   a compliant dielectric layer, wherein the reinforced dielectric layer is between the compliant dielectric layer and the first conductive layer, and wherein the portions of the first conductive layer are at a surface of the reinforced dielectric layer remote from the compliant dielectric layer; and   a plurality of conductive connectors extending in the form of a post from a surface of the first conductive layer facing the surface of the reinforced dielectric layer through the reinforced dielectric layer and the compliant dielectric layer, wherein the conductive connectors are electrically connected to the portions of the first conductive layer.   
     
     
         29 . The connection component of  claim 28  further comprising:
 first conductive elements exposed at a surface of the compliant dielectric layer remote from the reinforced dielectric layer and electrically connected to the conductive connectors. 
 
     
     
         30 . The connection component of  claim 29 , wherein at least one of the first conductive elements is in the form of a post. 
     
     
         31 . The connection component of  claim 29  further comprising:
 second conductive elements exposed at surfaces of the first conductive elements. 
 
     
     
         32 . The connection component of  claim 31 , wherein at least one of the second conductive elements is a solder element. 
     
     
         33 . The connection component of  claim 28  further comprising:
 an attachment layer overlying a surface of the first conductive layer remote from the reinforced dielectric layer. 
 
     
     
         34 . The connection component of  claim 33 , wherein the attachment layer includes a dielectric layer. 
     
     
         35 . The connection component of  claim 34 , wherein the dielectric layer of the attachment layer includes a compliant layer. 
     
     
         36 . The connection component of  claim 28 , wherein the reinforced dielectric layer is fiberglass-reinforced epoxy. 
     
     
         37 . The connection component of  claim 28  further comprising:
 a second conductive layer between the reinforced dielectric layer and the compliant dielectric layer and having portions electrically connected to the conductive connectors. 
 
     
     
         38 . The connection component of  claim 37  further comprising:
 first conductive elements exposed at a surface of the compliant dielectric layer remote from the reinforced dielectric layer and electrically connected to the conductive connectors. 
 
     
     
         39 . The connection component of  claim 38 , wherein the first conductive elements are portions of a third conductive layer. 
     
     
         40 . The connection component of  claim 38 , wherein at least one of the first conductive elements is in the form of a post. 
     
     
         41 . The connection component of  claim 38  further comprising:
 second conductive elements exposed at surfaces of the first conductive elements. 
 
     
     
         42 . The connection component of  claim 41 , wherein at least one of the second conductive elements is a solder element. 
     
     
         43 . The connection component of  claim 37  further comprising:
 an attachment layer overlying a surface of the first conductive layer remote from the reinforced dielectric layer. 
 
     
     
         44 . The connection component of  claim 43 , wherein the attachment layer includes a dielectric layer. 
     
     
         45 . The connection component of  claim 43 , wherein the dielectric layer of the attachment layer includes a compliant layer. 
     
     
         46 . The connection component of  claim 37 , wherein the reinforced dielectric layer is fiberglass-reinforced epoxy. 
     
     
         47 . The connection component of  claim 28  further comprising:
 solder elements overlying a surface of the first conductive layer remote from the reinforced dielectric layer and electrically connected with the portions of the first conductive layer. 
 
     
     
         48 . The connection component of  claim 28 , wherein the first conductive layer or at least one of the connectors is a solid metal. 
     
     
         49 . The connection component of  claim 28 , wherein the first conductive layer or at least one of the connectors includes copper or a copper-based alloy. 
     
     
         50 . The connection component of  claim 28 , wherein the at least one of the connectors is integral with the first conductive layer. 
     
     
         51 . The connection component of  claim 29 , wherein the first conductive elements consist essentially of copper or copper-based alloy. 
     
     
         52 . The connection component of  claim 51  further comprising:
 solder joined with the first conductive elements. 
 
     
     
         53 . A connection component comprising:
 a reinforced dielectric layer having a first surface remote from a second surface;   a conductive layer having portions in accordance with a predetermined pattern at the first surface of the reinforced dielectric layer;   a plurality of conductive connectors extending in the form of a post from a surface of the conductive layer facing the first surface of the reinforced dielectric layer through the reinforced dielectric layer, wherein the conductive connectors are electrically connected to the portions of the conductive layer; and   at least one wire bond electrically connected with one of the portions of the conductive layer and extending away from the first surface of the reinforced dielectric layer to an end configured for coupling to a component external the connection component.   
     
     
         54 . The connection component of  claim 53  further comprising:
 conductive elements exposed at the second surface of the reinforced dielectric layer and electrically connected to the conductive connectors. 
 
     
     
         55 . The connection component of  claim 54 , wherein at least one of the conductive elements is in the form of a post. 
     
     
         56 . The connection component of  claim 53 , wherein the at least one wire bond extends from the one of the portions of the conductive layer.