US2014196744A1PendingUtilityA1

Method and device for cleaning a brush surface having a contamination

Assignee: TAIWAN SEMICONDUCTOR MFGPriority: Jan 11, 2013Filed: Jan 11, 2013Published: Jul 17, 2014
Est. expiryJan 11, 2033(~6.5 yrs left)· nominal 20-yr term from priority
A46B 17/06H10P 52/00
45
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Claims

Abstract

A method for cleaning a brush surface having a contamination is provided. The method includes steps of: providing a mechanical wave; and stripping off the contamination from the brush surface by the mechanical wave.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method for cleaning a brush surface having a contamination, comprising steps of:
 providing a mechanical wave; and   stripping off the contamination from the brush surface by the mechanical wave.   
     
     
         2 . A method as claimed in  claim 1 , wherein the contamination includes a contaminant particle having a particle surface, the brush surface has a first surface charge thereon, the particle surface has a second surface charge thereon, the first surface charge has an electric polarity the same with that of the second surface charge, and the method further comprises steps of:
 enhancing the second surface charge, so that the contaminant particle is repelled from the brush surface; and   causing the brush surface to have a motion.   
     
     
         3 . A method as claimed in  claim 2 , wherein:
 the electric polarity is negative; and   the motion includes a rotation.   
     
     
         4 . A method as claimed in  claim 2 , wherein the step of enhancing the second surface charge on the particle surface is performed by a functional water process. 
     
     
         5 . A method as claimed in  claim 2 , wherein the step of enhancing the second surface charge on the particle surface is performed by a chemical process. 
     
     
         6 . A method as claimed in  claim 1 , wherein:
 the mechanical wave is a megasonic wave, and is applied to the brush surface through a fluid;   the fluid includes one of a functional water and an alkaline solution; and   the brush surface is used to clean a wafer in a chemical-mechanical planarization process.   
     
     
         7 . A method for cleaning a brush surface having a first surface charge and a contaminant particle having a particle surface having a second surface charge, wherein the first surface charge has an electric polarity the same with that of the second surface charge, comprising a step of:
 causing the second surface charge to be enhanced, so that the contaminant particle is repelled from the brush surface.   
     
     
         8 . A method as claimed in  claim 7 , wherein the electric polarity is negative. 
     
     
         9 . A method as claimed in  claim 7 , wherein the step of enhancing the second surface charge is performed by a functional water process. 
     
     
         10 . A method as claimed in  claim 9 , wherein the functional water process is performed by adding an H2 water to form a solution system for reducing a oxidation/reduction potential of the solution system. 
     
     
         11 . A method as claimed in  claim 7 , wherein the step of enhancing the second surface charge is performed by a chemical process. 
     
     
         12 . A method as claimed in  claim 11 , wherein the chemical process is performed by adding an alkaline solution to reduce a zeta potential of the contaminant particle. 
     
     
         13 . A method as claimed in  claim 11 , wherein the chemical process is used to facilitate a dissociation of a functional group from the contaminant particle. 
     
     
         14 . A device for cleaning a brush surface having a first surface charge and a contaminant particle having a particle surface having a second surface charge, wherein the first surface charge has an electric polarity the same with that of the second surface charge, comprising:
 a cleaning module configured to enhance the second surface charge on the particle surface, so that the contaminant particle is repelled from the brush surface.   
     
     
         15 . A device as claimed in  claim 14 , further comprising:
 a bath including a pool region, a bottom region, an inlet region and a first wall disposed above the inlet region, wherein the inlet region provides a fluid to the pool region therethrough, and the fluid includes at least one of a functional water and an alkaline solution;   a megasonic device disposed in the bottom region, and providing a mechanical wave;   a discharge unit including an overflow region surrounding the first wall, a second wall surrounding the overflow region, and an outlet region, wherein when the pool region overflows, an overflow portion of the fluid is discharged through the overflow region and the outlet region.   
     
     
         16 . A method as claimed in  claim 15 , wherein the mechanical wave is a megasonic wave. 
     
     
         17 . A device as claimed in  claim 15 , wherein the cleaning module performs a functional water process to reduce a oxidation/reduction potential of the fluid. 
     
     
         18 . A device as claimed in  claim 14 , wherein the cleaning module performs a chemical process to reduce a zeta potential of the contaminant particle. 
     
     
         19 . A device as claimed in  claim 14 , wherein the contaminant particle is one selected from a group consisting of a PSi, an Si3N4, an SiO2, an Al2O3, and the combination thereof. 
     
     
         20 . A device as claimed in  claim 14 , further comprising a detector detecting an electric polarity of one of the first and second surface charges.

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