Assignee
TAIWAN SEMICONDUCTOR MFG
TW·8,293 granted patents·819 pending applications·186,549 citations·filing 1987–2021
Top patents by PatentIndex Score
9,112 records- 0199US9379078B23D die stacking structure with fine pitchesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 28, 2016·86 cites·20 claims
- 0299US9372206B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 21, 2016·1.8k cites·20 claims
- 0399US9368460B2Fan-out interconnect structure and method for forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 14, 2016·1k cites·20 claims
- 0499US9362292B1Two-port SRAM cell structure for vertical devicesTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 7, 2016·41 cites·20 claims
- 0599US9304403B2System and method for lithography alignmentTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 5, 2016·64 cites·20 claims
- 0699US9275925B2System and method for an improved interconnect structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 1, 2016·64 cites·20 claims
- 0799US9263511B2Package with metal-insulator-metal capacitor and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 16, 2016·1k cites·20 claims
- 0899US9257439B2Structure and method for FinFET SRAMTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 9, 2016·56 cites·20 claims
- 0999US9257399B23D integrated circuit and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 9, 2016·232 cites·19 claims
- 1099US9251888B1SRAM cells with vertical gate-all-round MOSFETsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 2, 2016·70 cites·20 claims
- 1199US9236877B2Micro-electro-mechanical systems (MEMS), systems, and operating methods thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 12, 2016·49 cites·20 claims
- 1299US9236300B2Contact plugs in SRAM cells and the method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jan 12, 2016·1.4k cites·20 claims
- 1399US9223220B2Photo resist baking in lithography processTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 29, 2015·169 cites·20 claims
- 1499US9218872B1Memory chip and layout design for manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 22, 2015·85 cites·20 claims
- 1599US9209247B2Self-aligned wrapped-around structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 8, 2015·782 cites·20 claims
- 1699US9184054B1Method for integrated circuit patterningTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 10, 2015·786 cites·20 claims
- 1799US9184269B2Silicon and silicon germanium nanowire formationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 10, 2015·39 cites·20 claims
- 1899US9153478B2Spacer etching process for integrated circuit designTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 6, 2015·118 cites·20 claims
- 1999US9146469B2Middle layer composition for trilayer patterning stackTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 29, 2015·115 cites·7 claims
- 2099US9105490B2Contact structure of semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Aug 11, 2015·1.6k cites·19 claims
- 2199US9053279B2Pattern modification with a preferred position functionTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 9, 2015·104 cites·20 claims
- 2299US9048222B2Method of fabricating interconnect structure for package-on-package devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 2, 2015·1.1k cites·20 claims
- 2399US9040334B2MEMS integrated pressure sensor devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 26, 2015·68 cites·20 claims
- 2499US8993380B2Structure and method for 3D IC packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 31, 2015·900 cites·22 claims
- 2599US8975129B1Method of making a FinFET deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 10, 2015·60 cites·20 claims
- 2699US8963258B2FinFET with bottom SiGe layer in source/drainTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 24, 2015·342 cites·20 claims
- 2799US8908421B2Methods and apparatus for FinFET SRAM arrays in integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 9, 2014·90 cites·20 claims
- 2899US8877554B2Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 4, 2014·621 cites·20 claims
- 2999US8860229B1Hybrid bonding with through substrate via (TSV)TAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 14, 2014·72 cites·20 claims
- 3099US8853025B2FinFET/tri-gate channel doping for multiple threshold voltage tuningTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 7, 2014·507 cites·20 claims
- 3199US8836141B2Conductor layout technique to reduce stress-induced void formationsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 16, 2014·105 cites·13 claims
- 3299US8828823B2FinFET device and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 9, 2014·194 cites·20 claims
- 3399US8823065B2Contact structure of semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Sep 2, 2014·1.3k cites·16 claims
- 3499US8809139B2Fin-last FinFET and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Aug 19, 2014·224 cites·20 claims
- 3599US8803306B1Fan-out package structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·599 cites·20 claims
- 3699US8802504B13D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·408 cites·20 claims
- 3799US8802538B1Methods for hybrid wafer bondingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·269 cites·20 claims
- 3899US8785299B2Package with a fan-out structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 22, 2014·583 cites·19 claims
- 3999US8772109B2Apparatus and method for forming semiconductor contactsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 8, 2014·1.3k cites·12 claims
- 4099US8703565B2Bottom-notched SiGe FinFET formation using condensationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 22, 2014·207 cites·19 claims
- 4199US8669174B2Multi-die stacking using bumps with different sizesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 11, 2014·139 cites·20 claims
- 4299US8652894B2Method for fabricating a FinFET deviceTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Feb 18, 2014·394 cites·20 claims
- 4399US8497177B1Method of making a FinFET deviceTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 30, 2013·252 cites·20 claims
- 4499US8377798B2Method and structure for wafer to wafer bonding in semiconductor packagingTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 19, 2013·222 cites·23 claims
- 4599US8377779B1Methods of manufacturing semiconductor devices and transistorsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Feb 19, 2013·437 cites·20 claims
- 4699US8367498B2Fin-like field effect transistor (FinFET) device and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 5, 2013·267 cites·19 claims
- 4799US8362575B2Controlling the shape of source/drain regions in FinFETsTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jan 29, 2013·242 cites·18 claims
- 4899US8361842B2Embedded wafer-level bonding approachesTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jan 29, 2013·628 cites·14 claims
- 4999US8053299B2Method of fabrication of a FinFET elementTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Nov 8, 2011·244 cites·15 claims
- 5099US8048723B2Germanium FinFETs having dielectric punch-through stoppersTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Nov 1, 2011·265 cites·17 claims
Showing the top 50 of 9,112 patent records by PatentIndex Score.
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