Deposition ring and electrostatic chuck for physical vapor deposition chamber

Abstract

Embodiments of the invention generally relate to a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a kit. More specifically, embodiments described herein relate to a process kit including a deposition ring and a pedestal assembly. The components of the process kit work alone, and in combination, to significantly reduce their effects on the electric fields around a substrate during processing.

What is claimed is: 
     
         1 . A cover ring for use in a substrate processing chamber, comprising:
 an annular body;   a top surface;   an inner cylindrical ring;   an outer cylindrical ring;   a wedge coupled to the annular body, comprising:
 an inclined top surface; and 
 a projecting bulbous brim; and 
   a footing.   
     
     
         2 . The cover ring of  claim 1 , further comprising a dual-stepped surface, wherein the dual-stepped surface is between the footing and a lower surface of the projecting bulbous brim. 
     
     
         3 . A ground shield for use in a substrate processing chamber, comprising:
 an inner cylindrical ring;   an outer cylindrical ring, comprising:
 a first top surface; 
 a second top surface; 
 a bottom surface; 
 a first inner edge, wherein the first inner edge is adjacent to the first top surface; 
 a first outer edge, wherein the first outer edge is adjacent to the bottom surface; 
 a substantially vertical inner wall, wherein the substantially vertical inner wall meets the first inner edge; 
 a substantially vertical first outer wall, wherein the substantially vertical first outer wall meets the first outer edge; 
 a second outer wall, wherein the second outer wall is adjacent to the second top surface and the bottom surface; and 
   a base, wherein the inner cylindrical ring is connected to the outer cylindrical ring by the base.   
     
     
         4 . The ground shield of  claim 3 , wherein the substantially vertical inner wall is textured. 
     
     
         5 . The ground shield of  claim 3 , further comprising a notch with a bolt in the outer cylindrical ring in a polar array. 
     
     
         6 . A pedestal assembly for use in a substrate processing chamber, comprising:
 a base plate; and   a flangeless electrostatic chuck coupled to the base plate; the flangeless electrostatic chuck having a height greater than about 0.25 inches, wherein the flangeless electrostatic chuck has a dielectric body having electrodes embedded therein.   
     
     
         7 . The pedestal assembly of  claim 6 , wherein the base plate has a cooling conduit disposed therein. 
     
     
         8 . The pedestal assembly of  claim 6 , wherein the height of the flangeless electrostatic chuck is between about 0.30 to about 0.75 inches.