Method of forming hole for interlayer connection conductor, method of producing resin substrate and component-incorporated substrate, and resin substrate and component-incorporated substrate

Abstract

A high quality component-incorporated substrate achieves a sufficient connection between an in-plane electrode and an interlayer connection conductor at low cost. A method of forming a hole for an interlayer connection conductor of a resin substrate includes a step of forming an in-plane electrode in a core substrate, a step of forming a light reflective conductor for reflecting a laser beam applied on the in-plane electrode in a later step, a step of forming a resin layer so as to cover the core substrate, the in-plane electrode and the light reflective conductor, and a step of forming a hole for the interlayer connection conductor by removing the resin layer on the light reflective conductor through the use of a laser beam.

1 . A method of forming a hole for an interlayer connection conductor, the method comprising the steps of:
 preparing a base material including an in-plane electrode in a top surface thereof;   forming a light reflective conductor arranged to reflect a laser beam on the in-plane electrode;   forming a resin layer on the base material so as to cover the in-plane electrode and the light reflective conductor; and   forming the hole for the interlayer connection conductor by removing the resin layer on the light reflective conductor through the use of a laser beam.   
     
     
         2 . A method of producing a resin substrate, the method comprising:
 a first step of preparing a base material including an in-plane electrode in a top surface thereof;   a second step of forming a light reflective conductor arranged to reflect a laser beam on the in-plane electrode;   a third step of forming a resin layer on the base material so as to cover the in-plane electrode and the light reflective conductor;   a fourth step of forming a hole for an interlayer connection conductor by removing the resin layer on the light reflective conductor through the use of a laser beam; and   a fifth step of forming the interlayer connection conductor by covering or filling the hole for the interlayer connection conductor with a conductive material.   
     
     
         3 . The method of producing a resin substrate according to  claim 2 , wherein the light reflective conductor has a smooth surface facing an irradiation direction of the laser beam. 
     
     
         4 . The method of producing a resin substrate according to  claim 2 , wherein in the second step, the light reflective conductor is formed by applying a solder paste on the in-plane electrode, and melting the solder paste by heating. 
     
     
         5 . The method of producing a resin substrate according to  claim 2 , further comprising a step of roughening a surface of the in-plane electrode prior to the second step. 
     
     
         6 . The method of producing a resin substrate according to  claim 2 , wherein the base material is a ceramic substrate, and the in-plane electrode is a sintered metal that is fired simultaneously with the ceramic substrate. 
     
     
         7 . A method of producing a component-incorporated substrate, the method comprising:
 a first step of preparing a base material including an in-plane electrode in a top surface thereof;   a second step of forming a light reflective conductor for reflecting a laser beam on the in-plane electrode;   a third step of forming a mounting conductor arranged to mount a mount component on the in-plane electrode;   a fourth step of mounting the mount component on the in-plane electrode via the mounting conductor;   a fifth step of forming a resin layer on the base material so as to cover the in-plane electrode, the light reflective conductor and the mount component;   a sixth step of forming a hole for an interlayer connection conductor by removing a resin layer on the light reflective conductor through the use of a laser beam; and   a seventh step of forming the interlayer connection conductor by covering or filling the hole for the interlayer connection conductor with a conductive material.   
     
     
         8 . The method of producing a component-incorporated substrate according to  claim 7 , wherein the light reflective conductor has a smooth surface facing an irradiation direction of the laser beam. 
     
     
         9 . The method of producing a component-incorporated substrate according to  claim 7 , wherein in the second step, the light reflective conductor is formed by applying a solder paste on the in-plane electrode, and melting by heating. 
     
     
         10 . The method of producing a component-incorporated substrate according to  claim 7 , wherein the second to fourth steps are performed by:
 a step of applying a solder paste simultaneously in a light reflective conductor forming region and in a mounting conductor forming region on the in-plane electrode;   a step of mounting the mount component on the solder paste applied on the mounting conductor forming region; and   a step of mounting the mount component simultaneously with forming the light reflective conductor by simultaneously melting the solder paste on the light reflective conductor forming region and on the mounting conductor forming region by heating.   
     
     
         11 . The method of producing a component-incorporated substrate according to  claim 7 , further comprising, prior to the second step, a step of roughening a surface of the in-plane electrode. 
     
     
         12 . The method of producing a component-incorporated substrate according to  claim 7 , wherein the base material is a ceramic substrate, and the in-plane electrode is a sintered metal obtained by simultaneously firing with the ceramic substrate.