Assignee
SEKIMOTO YASUYUKI
JP·3 granted patents·1 pending application·7 citations·filing 2009–2012
Top patents by PatentIndex Score
4 records- 0165US8570763B2Method of forming hole for interlayer connection conductor, method of producing resin substrate and component-incorporated substrate, and resin substrate and component-incorporated substrateSEKIMOTO YASUYUKI·Filed 2009·Granted Oct 29, 2013·4 cites·6 claims
- 0259US8419884B2Method for manufacturing multilayer wiring substrateSEKIMOTO YASUYUKI·Filed 2010·Granted Apr 16, 2013·2 cites·7 claims
- 0358US8794499B2Method for manufacturing substrateSEKIMOTO YASUYUKI·Filed 2011·Granted Aug 5, 2014·1 cites·6 claims
- 0442US2012321814A1Method of forming hole for interlayer connection conductor, method of producing resin substrate and component-incorporated substrate, and resin substrate and component-incorporated substrateSEKIMOTO YASUYUKI·Filed 2012·Application pending·0 cites
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