Mold and manufacturing method therefor

Abstract

Providing a mold and a manufacturing method therefor wherein protrusions are easy to be pressed into a resin base material and the protrusions are easy to be pulled out from the resin base material. The present invention provides a mold comprising a stamping surface ( 1 a ) formed depending on a via pattern and a protruding portion ( 21, 22 ) formed in convex shape from the stamping surface ( 1 a ), wherein the protruding portion has a base portion ( 111, 121 ) merging into a main surface of the stamping surface ( 1 a ) to have a curvature and a slope portion ( 113, 123 ) progressively decreasing in outer diameter thereof from the base portion ( 111, 121 ) to a top portion ( 112, 122 ) of the protruding portion ( 21, 22 ).

1 . A mold comprising a stamping surface formed depending on a pattern, wherein
 the stamping surface has a protruding portion formed in convex shape on a main surface side of the stamping surface depending on a via pattern, and wherein   the protruding portion has a base portion merging into the main surface of the stamping surface to have a curvature and a slope portion progressively decreasing in outer diameter thereof from the base portion to a top portion of the protruding portion.   
     
     
         2 . The mold as set forth in  claim 1 , wherein the slope portion has a substantially taper-shaped cross section along a moving direction of the stamping surface. 
     
     
         3 . The mold as set forth in  claim 1 , wherein the top portion has a curved surface. 
     
     
         4 . The mold as set forth in  claim 1 , wherein the protruding portion comprises a plurality of protruding portions with different heights. 
     
     
         5 . The mold as set forth in  claim 1 , wherein the protruding portion comprises a plurality of protruding portions with different heights, and the top portion of each protruding portion has a curved surface. 
     
     
         6 . The mold as set forth in  claim 1 , wherein the stamping surface further has a convex portion formed on the main surface side of the stamping surface depending on a wiring pattern, and wherein
 the base portion of the protruding portion merges into an upper surface of the convex portion to have a curvature.   
     
     
         7 . A manufacturing method for a mold, comprising:
 preparing a resin plate body cured;   forming a hole in the resin plate body depending on a via pattern by irradiating laser or electron beam to a main surface of the resin plate body; and   using a mold material to fill the hole formed in the resin plate body and to cover the main surface of the resin plate body.   
     
     
         8 . The manufacturing method for a mold as set forth in  claim 7 , wherein
 the forming a hole in the resin plate body includes irradiating laser or electron beam to the resin plate body such that the hole formed in the resin plate body has at its opening area an inner wall merging into the main surface of the resin plate body with a curvature.   
     
     
         9 . The manufacturing method for a mold as set forth in  claim 7 , wherein
 the forming a hole in the resin plate body includes irradiating laser or electron beam to the resin plate body such that a slope wall is formed which progressively decreases in outer diameter thereof from an inner wall of opening area of the hole formed in the resin plate body to a bottom area.   
     
     
         10 . The manufacturing method for a mold as set forth in  claim 7 , wherein
 the forming a hole in the resin plate body includes irradiating laser or electron beam to the resin plate body such that a given energy by the laser or electron beam gradually decreases from an opening area of the hole to a bottom area of the hole.   
     
     
         11 . The manufacturing method for a mold as set forth in  claim 7 , wherein
 the forming a hole in the resin plate body is such that a beam diameter of the laser when forming an opening area of the hole is larger than a beam diameter of the laser when forming a bottom area of the hole.   
     
     
         12 . The manufacturing method for a mold as set forth in  claim 7 , wherein
 the forming a hole in the resin plate body includes irradiating laser or electron beam to the resin plate body such that the hole formed in the resin plate body has at its opening area an inner wall merging into the main surface of the resin plate body with a curvature, a slope wall is formed which progressively decreases in outer diameter thereof from the inner wall of the opening area of the hole formed in the resin plate body to a bottom area, and the bottom area of the hole is formed in curved surface like.   
     
     
         13 . The manufacturing method for a mold as set forth in  claim 7 , further comprising, after the forming a hole,
 laminating a resist layer on the main surface of the resin plate body formed therein with the hole; and   removing by photolithographic method the resist layer within a predetermined region including an opening region of the hole, depending on a wiring pattern, wherein   the using a mold material to fill the hole formed in the resin plate body includes covering with the mold material the resist layer removed therefrom the predetermined region and the main surface of the resin plate body.