Assignee
HONDO TAKAHARU
JP·2 granted patents·2 pending applications·2 citations·filing 2008–2012
Top patents by PatentIndex Score
4 records- 0154US8502086B2Laminated wiring board and method for manufacturing the sameHONDO TAKAHARU·Filed 2008·Granted Aug 6, 2013·2 cites·7 claims
- 0247US2012305179A1Mold and manufacturing method thereforHONDO TAKAHARU·Filed 2012·Application pending·0 cites
- 0340US9232662B2Manufacturing method for wiring boardHONDO TAKAHARU·Filed 2012·Granted Jan 5, 2016·0 cites·3 claims
- 0438US2012216946A1Method of manufacturing wiring substrateHONDO TAKAHARU·Filed 2012·Application pending·0 cites
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