Method for integration of circuit components into the build-up layers of a printed wiring board

Abstract

The present invention provides a printed wiring board assembly having active and passive components embedded between the printed wiring board layers and associated fabrication method so as to complete a multilayer printed wiring board to improve the flexibility of circuit layout.

1 . A printed wiring board assembly, comprising:
 a plurality of core and pre-impregnated layers;   one or more components installed onto a support layer of said printed wiring board assembly, wherein the one or more components are electrically coupled to the printed wiring board assembly; and   wherein the one or more components are situated inside cavities internal to the printed wiring board assembly.   
     
     
         2 . A printed wiring board according to  claim 1 , wherein the printed wiring board is laminated. 
     
     
         3 . A printed wiring board assembly according to  claim 1 . wherein the core and pre-impregnated layers are juxtaposed in an alternating sequence. 
     
     
         4 . A printed wiring board assembly according to  claim 1 , comprising at least one core layer and at least two pre-impregnated layers. 
     
     
         5 . A printed wiring board assembly wherein the printed wiring board comprises:
 a first set of layers comprising core and pre-impregnated layers;   a second set of layers comprising core and pre-impregnated layers including cavities to accommodate one or more components;   a third set of layers comprising core and pre-impregnated layers for encapsulating said cavities.   
     
     
         6 . A printed wiring board assembly according to  claim 5 , wherein the first, second and third set of layers collectively comprise at least one core layer and at least two pre-impregnated layers. 
     
     
         7 . A printed wiring board assembly according to  claim 5 , wherein the core and pre-impregnated layers of said first, second and third layers are juxtaposed in an alternating sequence. 
     
     
         8 . A printed wiring board assembly according to  claim 5 , wherein the first set of layers are pre-constructed as a lamina. 
     
     
         9 . A printed wiring board according to  claim 5 , wherein the printed wiring board is laminated.