Inventor · disambiguated record

Craig F. Lapinski

Also filed as: LAPINSKI CRAIG F

1 granted patent·1 pending application·0 citations·filing 2009–2012

13Inventor score

Technology areasH10W

Files withTEZAK TIMOTHY L2

Top patents by PatentIndex Score

2 records

0129US8186042B2Manufacturing method of a printed board assemblyTEZAK TIMOTHY L·Filed 2009·Granted May 29, 2012·0 cites·11 claims
0223US2012206890A1Method for integration of circuit components into the build-up layers of a printed wiring boardTEZAK TIMOTHY L·Filed 2012·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →