System and method for reducing object deformation during a pulsed heating process

Abstract

An approach for optimizing the thermal budget during a pulsed heating process is disclosed. A heat sink or thermal transfer plate is configured and positioned near an object, such as a semiconductor wafer, undergoing thermal treatment. The heat sink is configured to enhance the thermal transfer rate from the object so that the object is rapidly brought down from the peak temperature after an energy pulse. High thermally-conductive material may be positioned between the plate and the object. The plate may include protrusions, ribs, holes, recesses, and other discontinuities to enhance heat transfer and avoid physical damage to the object during the thermal cycle. Additionally, the optical properties of the plate may be selected to allow for temperature measurements via energy measurements from the plate, or to provide for a different thermal response to the energy pulse. The plate may also allow for pre-heating or active cooling of the wafer.

1 - 50 . (canceled) 
     
     
         51 . A thermal processing method, comprising:
 positioning an object in a thermal processing chamber such that the object is adjacent to a thermal transfer plate;   pre-heating the object; and   heating at least a first location on the object by directing at least one pulse of energy toward the first location on the object for a duration of less than 1 second;   wherein the the' Hal transfer plate has a flexibility configured to reduce object deformation during the thermal processing of the object.   
     
     
         52 . The method of  claim 51 , wherein the thermal transfer plate has a first region and a second region, the flexibility of the thermal transfer plate at the first region being different than the flexibility of the thermal transfer plate at the second region. 
     
     
         53 . The method of  claim 51 , wherein the flexibility of the thermal transfer plate is optimized to reduce object deformation during thermal processing of the object by configuring the stiffness of the thermal transfer plate. 
     
     
         54 . The method of  claim 51 , wherein the flexibility of the thermal transfer plate is optimized to reduce object deformation during the thermal processing of the object by configuring the thickness of the thermal transfer plate. 
     
     
         55 . The method of  claim 51 , wherein the flexibility of the thermal transfer plate is configured to reduce object deformation by incorporating at least one discontinuity in the thermal transfer plate. 
     
     
         56 . The method of  claim 55 , wherein the discontinuity has a size that is less than a thermal diffusion length associated with the thermal process. 
     
     
         57 . The method of  claim 55 , wherein the discontinuity comprises at least one of a slit, a rib, a recess, a protrusion, or a hole. 
     
     
         58 . The method of  claim 55 , wherein the discontinuity has a dimension of about 2 mm or less. 
     
     
         59 . The method of  claim 51 , wherein heating the object comprises scanning the surface of the object with a laser. 
     
     
         60 . The method of  claim 51 , wherein heating the object comprises illuminating the object with at least one lamp. 
     
     
         61 . The method of  claim 51 , wherein the thermal transfer plate is positioned such that the plate and a surface of the object are approximately parallel to one another and define a gap. 
     
     
         62 . The method of  claim 61 , wherein the gap is partially bridged by at least one of an offset or a protrusion. 
     
     
         63 . The method of  claim 61 , wherein the distance of a first portion of the thermal transfer plate from the object is less than the distance of a second portion of the thermal transfer plate from the object. 
     
     
         64 . The method of  claim 61 , wherein the method comprises delivering a gas into the gap. 
     
     
         65 . A system for thermal treatment of an object within a chamber, comprising:
 a heating arrangement configured to direct a pulse of energy towards a surface of an object; and   a thermal transfer plate positioned adjacent to the object, the thermal transfer plate having a flexibility that is configured to reduce object deformation during thermal treatment of the object.   
     
     
         66 . The system of  claim 65 , wherein the thermal transfer plate has a first region and a second region, the flexibility of the thermal transfer plate at the first region being different than the flexibility of the thermal transfer plate at the second region. 
     
     
         67 . The system of  claim 65 , wherein the thermal transfer plate has a stiffness that is optimized to reduce object deformation during thermal treatment of the object. 
     
     
         68 . The system of  claim 65 , wherein the thermal transfer plate has a thickness that is optimized to reduce object deformation during thermal treatment of the object. 
     
     
         69 . The system of  claim 65 , wherein the thermal transfer plate comprises at least one discontinuity in the thermal transfer plate. 
     
     
         70 . The system of  claim 69 , wherein the discontinuity has a size that is less than a thermal diffusion length associated with the thermal process. 
     
     
         71 . The system of  claim 69 , wherein the discontinuity comprises at least one of a slit, a rib, a recess, a protrusion, or a hole. 
     
     
         72 . The system of  claim 69 , wherein the discontinuity has a dimension of about 2 mm or less. 
     
     
         73 . The system of  claim 65 , wherein the thermal transfer plate and the object are separated by a gap. 
     
     
         74 . The system of  claim 73 , wherein the gap is partially bridged by at least one of an offset or a protrusion. 
     
     
         75 . The system of  claim 73 , wherein the distance of a first portion of the thermal transfer plate from the object is less than the distance of a second portion of the thermal transfer plate from the object. 
     
     
         76 . The system of  claim 73 , wherein the gap is filled with a gas. 
     
     
         77 . A method, comprising:
 preparing a thermal transfer plate for use in a thermal processing chamber used for thermally treating an object, the thermal transfer plate configured to be positioned adjacent to the object, the thermal processing chamber configured to direct at least one pulse of energy toward the object for a duration of less than 1 second;   adjusting the flexibility of the thermal transfer plate to reduce object deformation during thermal treatment of the object.   
     
     
         78 . The method of  claim 77 , wherein adjusting the flexibility of the thermal transfer plate comprises adjusting the stiffness of the material used to construct the thermal transfer plate. 
     
     
         79 . The method of  claim 77 , wherein adjusting the flexibility of the thermal transfer plate comprises adjusting the thickness of the thermal transfer plate. 
     
     
         80 . The method of  claim 77 , wherein adjusting the flexibility of the thermal transfer plate comprises incorporating a discontinuity in thermal transfer plate. 
     
     
         81 . The method of  claim 80 , wherein the discontinuity has a size that is less than a thermal diffusion length associated with the object. 
     
     
         82 . The method of  claim 80 , wherein the discontinuity comprises at least one of a slit, a rib, a recess, a protrusion, or a hole. 
     
     
         83 . The method of  claim 80 , wherein the discontinuity has a dimension of about 2 mm or less.