Extendable mes for cross-amhs transportation

Abstract

A cross-semiconductor fabrication (fab) facility transportation system and method for cross-fab transportation is provided. An exemplary method for cross-fab transportation includes providing a unified control unit that facilitates transportation of one or more wafers across a plurality of wafer fabrication facilities (“fabs”). The unified control unit facilitates selecting a wafer at a first location in a first automated material handling system (“AMHS”) of a first fab for transfer to a second AMHS of a second fab; selecting a second location within the second AMHS of the second fab; selecting a route for transferring the wafer between the first location and the second location; and issuing instructions to the first and second fabs, such that the wafer is transferred from the first location to the second location.

1 . A method of implementing a factory automation system for automated wafer transfers across a plurality of wafer fabrication facilities (“fabs”), the method comprising:
 providing a unified control unit that facilitates transportation of one or more wafers across the plurality of fabs, wherein the unified control unit facilitates:   defining a bridge connecting a first automated material handling system (“AMHS”) of a first fab and a second AMHS of a second fab;   selecting a wafer located in the first AMHS of the first fab for transfer to the second AMHS of the second fab, the wafer positioned at a first location;   selecting a second location within the second AMHS of the second fab as a destination for the wafer;   selecting a route for transferring the wafer between the first location and the second location, the route including at least a portion of the bridge;   transferring the wafer from the first location to the bridge; and   transferring the wafer from the bridge to the second location.   
   
   
       2 . The method of  claim 1  wherein facilitating transportation of the wafer from the first location to the second location comprises communicating with a first material control system associated with the first AMHS and a second material control system associated with the second AMHS. 
   
   
       3 . The method of  claim 1  wherein selecting the route for transferring the wafer comprises selecting a first sub-route within the first AMHS, selecting a bridge sub-route between the first AMHS and the second AMHS, and selecting a second sub-route within the second AMHS. 
   
   
       4 . The method of  claim 1  further comprising:
 dispatching a first route transfer request to the first AMHS using a first communication protocol; and   dispatching a second route transfer request to the second AMHS using a second communication protocol.   
   
   
       5 . The method of  claim 4  wherein:
 dispatching the first route transfer request includes dispatching a first unified route transfer request and using a first translator to translate the first unified route transfer request into the first communication protocol; and   dispatching the second route transfer request includes dispatching a second unified route transfer request and using a second translator to translate the second unified route transfer request into the second communication protocol, the second communication protocol being different than the first communication protocol.   
   
   
       6 . The method of  claim 4  further comprising utilizing a transaction dispatcher to dispatch the first and second route transfer requests. 
   
   
       7 . A factory automation system for wafer transportation across automatic material handling systems (“AMHSs”), the factory automation system comprising:
 a first material control system (“MCS”) and an associated first AMHS;   a second MCS and an associated second AMHS;   a bridge connecting the first AMHS and the second AMHS, the bridge configured to allow a front opening unified pod (“FOUP”) to travel between the first AMHS and the second AMHS; and   a unified control unit in communication with the first and second MCSs, the unified control unit for coordinating transfers of the FOUP between the first and second AMHSs.   
   
   
       8 . The system of  claim 7  wherein the first MCS and the first AMHS communicate with the unified control unit with a first communication protocol and the second MCS and the second AMHS communicate with the unified control unit with a second communication protocol. 
   
   
       9 . The system of  claim 7  further comprising:
 a third MCS and an associated third AMHS; and   another bridge connecting the second AMHS and the third AMHS, the another bridge configured to allow the FOUP to travel between the second AMHS and the third AMHS, wherein the unified control unit is in communication with the third MCS, allowing the unified control unit to coordinate transfers of the FOUP between the first, second, and third AMHSs.   
   
   
       10 . The system of  claim 9  further comprising:
 a first translator for translating a communication from the unified control unit into a first communication protocol for use by the first MCS and the first AMHS;   a second translator for translating a communication from the unified control unit into a second communication protocol for use by the second MCS and the second AMHS; and   a third translator for translating a communication from the unified control unit into a third communication protocol for use by the third MCS and the third AMHS.   
   
   
       11 . The system of  claim 9  wherein the unified control unit includes a master MCS that communicates with the first and second MCSs. 
   
   
       12 . A method comprising:
 providing a unified control unit that facilitates transportation of one or more wafers across a plurality of wafer fabrication facilities (“fabs”), wherein the unified control unit facilitates:   selecting a wafer at a first location in a first automated material handling system (“AMHS”) of a first fab for transfer to a second AMHS of a second fab;   selecting a second location within the second AMHS of the second fab;   selecting a route for transferring the wafer between the first location and the second location; and   issuing instructions to the first and second fabs, such that the wafer is transferred from the first location to the second location.   
   
   
       13 . The method of  claim 12  wherein issuing instructions to the first and second fabs, such that the wafer is transferred from the first location to the second location, includes:
 utilizing a first interpreter to translate signals from the unified control unit to the first fab; and   utilizing a second interpreter to translate signals from the unified control unit to the second fab.   
   
   
       14 . The method of  claim 12  wherein selecting a route for transferring the wafer between the first location and the second location includes:
 determining a first sub-route for transferring the wafer between the first location and an intermediate location; and   determining a second sub-route for transferring the wafer between the intermediate location and the second location.   
   
   
       15 . The method of  claim 14  wherein issuing instructions to the first and second fabs, such that the wafer is transferred from the first location to the second location includes:
 communicating a first sub-route transfer request to the first AMHS; and   communicating a second sub-route transfer request to the second AMHS.   
   
   
       16 . The method of  claim 15  further comprising:
 after communicating the first sub-route transfer request to the first AMHS, transferring the wafer along the first sub-route from the first location to an intermediate location;   notifying the unified control unit that the wafer has been transferred to the intermediate location;   after communicating the second sub-route to the second AMHS, transferring the wafer along the second sub-route from the intermediate location to the second location; and   notifying the unified control unit that the wafer has been transferred to the second location.   
   
   
       17 . The method of  claim 15  wherein:
 communicating the first sub-route transfer request to the first AMHS includes utilizing a first communication protocol; and   communicating a second sub-route transfer request to the second AMHS includes utilizing a second communication protocol different than the first communication protocol.   
   
   
       18 . The method of  claim 12  further comprising:
 modifying the route for transferring the wafer between the first location and the second location; and   issuing instructions to the first and second fabs, such that the wafer is transferred along the modified route.   
   
   
       19 . The method of  claim 12  wherein selecting the route for transferring the wafer between the first location and the second location includes evaluating a plurality of routes for transferring the wafer between the first and second locations. 
   
   
       20 . The method of  claim 19  evaluating the plurality of routes includes evaluating at least one of traffic conditions, lot information, lot priority, routes distances, and maintenance schedules.