Method of evaluating adhesion property, low-adhesion material, and mold for molding resin

Abstract

A mold surface ( 6 ) of an upper mold ( 1 ) with which a fluid resin comes into contact has an oxide ( 3 ) therein. The oxide ( 3 ) contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and an ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface ( 6 ), releasability between the cured resin and the mold surface ( 6 ) is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface ( 6 ) is established. With this evaluation method, a material with high releasability ( 3 ) can readily be provided. Further, if the material with high releasability ( 3 ) is used for the mold surface ( 6 ) of the upper mold ( 1 ), a mold for molding a resin having excellent releasability can be obtained.

1 . A mold for molding a resin, comprising a mold surface including at least one substance selected from the group consisting of Y 2 O 3 , Gd 2 O 3 , Sm 2 O 3 , Eu 2 O 3 , Er 2 O 3 , Yb 2 O 3 , and Lu 2 O 3 .