Assignee
KUNO TAKAKI
0 granted patents·4 pending applications·0 citations·filing 2006–2011
Top patents by PatentIndex Score
4 records- 0160US2010012816A1Method of evaluating adhesion property, low-adhesion material, and mold for molding resinKUNO TAKAKI·Filed 2009·Application pending·0 cites
- 0254US2012076886A1Method of evaluating adhesion property, low-adhesion material, and mold for molding resinKUNO TAKAKI·Filed 2011·Application pending·0 cites
- 0352US2011042857A1Method of evaluating adhesion property, low-adhesion material, and mold for molding resinKUNO TAKAKI·Filed 2010·Application pending·0 cites
- 0442US2008296532A1Low Adhesion Material, Resin Molding Die, and Soil Resistant MaterialKUNO TAKAKI·Filed 2006·Application pending·0 cites
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