Chemical mechanical polish system having multiple slurry-dispensing systems

Abstract

A chemical mechanical polish system includes a polishing pad, a platen supporting and rotating the polishing pad, a top slurry dispenser placed over a polishing pad, a bottom slurry dispenser placed through an opening in the polishing pad, and a duct connected to the bottom slurry dispenser, the duct extending toward the bottom of the polishing pad.

1 . A chemical mechanical polish (CMP) system comprising:
 a polishing pad;   a platen supporting and rotating the polishing pad;   a top slurry dispenser placed over the polishing pad;   a bottom slurry dispenser placed through an opening in the polishing pad;   a first slurry storage connected to the top slurry dispenser;   a second slurry storage connected to the bottom slurry dispenser: and   a duct connected to the bottom slurry dispenser, the duct extending toward the bottom of the polishing pad.   
   
   
       2 . (canceled) 
   
   
       3 . The CMP system of  claim 1  further comprising a cleaning system, wherein the cleaning system comprises:
 a cleaning head placed through an opening in the polishing pad, the cleaning head being configured for performing at least one of the functions of:
 ejecting a cleaning solution onto the polishing pad; and 
 evacuating a slurry from the polishing pad; 
   a duct connected to the cleaning head; and   a pump connected to the duct.   
   
   
       4 . The CMP system of  claim 3 , wherein the cleaning head is the bottom slurry dispenser. 
   
   
       5 . The CMP system of  claim 3 , wherein the cleaning head is a separate component from the bottom slurry dispenser. 
   
   
       6 . The CMP system of  claim 1  further comprising an additional slurry dispenser for dispensing slurries onto the polishing pad. 
   
   
       7 . The CMP system of  claim 6 , wherein the additional slurry dispenser is connected to a third slurry storage. 
   
   
       8 . The CMP system of  claim 6 , wherein the additional slurry dispenser is connected to a same slurry storage as one of the first and the second slurry dispensers. 
   
   
       9 . A chemical mechanical polish (CMP) system comprising:
 a polishing pad;   a top slurry-dispensing system being configured for dispensing at least a first slurry component of a slurry from over the polishing pad, wherein the top slurry-dispensing system comprises a first slurry storage; and   a bottom slurry-dispensing system being configured for dispensing at least a second slurry component of the slurry from the bottom of and through an opening in the polishing pad, wherein the bottom slurry-dispensing system comprises a second slurry storage.   
   
   
       10 . The CMP system of  claim 9 , wherein the top slurry-dispensing system and the bottom slurry-dispensing system are capable of dispensing synchronously and asynchronously. 
   
   
       11 . The CMP system of  claim 9  further comprising a cleaning system connected from the bottom of the polishing pad, wherein the cleaning system is configured to perform at least one of the functions of injecting a cleaning solution on the polishing pad and evacuating a slurry from the polishing pad. 
   
   
       12 . The CMP system of  claim 9 , wherein the first slurry storage stores less expensive slurry components, and the second slurry storage stores more expensive slurry components. 
   
   
       13 . The CMP system of  claim 9 , wherein the first slurry storage stores a first portion of a slurry, and the second slurry storage stores a second portion of the slurry, and wherein the first portion and the second portion cannot be pre-mixed. 
   
   
       14 . The CMP system of  claim 9 , wherein the first slurry storage stores non-critical components of a slurry, and the second slurry storage stores critical components of the slurry. 
   
   
       15 . The CMP system of  claim 9 , wherein the first slurry storage and the second slurry storage store a same slurry. 
   
   
       16 . The CMP system of  claim 9 , wherein the first slurry storage stores non-clogging components of a slurry, and the second slurry storage stores clogging components of the slurry. 
   
   
       17 . The CMP system of  claim 9  further comprising a third slurry-dispensing system configured for dispensing slurries onto the polishing pad.