Method and system for communicating semiconductor manufacturing information to customers

Abstract

A method of communicating semiconductor manufacturing information. The method includes providing, by a first service provider, a lot of semiconductor components to a second service provider for processing. The method also includes receiving from the second service provider, by the first service provider, first information associated with the processing. The method further includes outputting to a customer, by the first service provider, second information determined in response to the first information.

1 . A method of communicating semiconductor manufacturing information, the method comprising: 
 providing, by a first service provider, a lot of semiconductor components to a second service provider for processing;    receiving, by the first service provider, first information associated with the processing, from the second service provider;    generating, by the first service provider, second information responsive to the first information; and    outputting, by the first service provider, the second information to a customer affiliated with the second service provider.    
   
   
       2 . The method of  claim 1  further comprising: 
 in association with providing the lot of semiconductor components to the second service provider for processing, providing, by the first service provider, a virtual work order to the second service provider.    
   
   
       3 . The method of  claim 1 , wherein the first service provider and the second service provider are separate business organizations.  
   
   
       4 . The method of  claim 1 , wherein the first information includes work-in-process (“WIP”) information.  
   
   
       5 . The method of  claim 4 , wherein receiving the WIP information is by periodically receiving the WIP information, in response to passage of a predetermined period of time.  
   
   
       6 . The method of  claim 1 , wherein the first information includes shipping information.  
   
   
       7 . The method of  claim 1 , wherein the first information includes lot yield information.  
   
   
       8 . The method of  claim 1 , wherein receiving the first information and outputting the second information are by receiving and outputting through a network.  
   
   
       9 . The method of  claim 8 , wherein the network is a global computer network.  
   
   
       10 . The method of  claim 8 , wherein receiving the first information and outputting the second information are by receiving and outputting using the file transfer protocol (“FTP”).  
   
   
       11 . The method of  claim 8 , wherein receiving the first information and outputting the second information are by receiving and outputting using the hyper text transfer protocol (“HTTP”).  
   
   
       12  The method of  claim 1 , wherein the lot of semi-conductor components is a lot of integrated chips (“IC's”).  
   
   
       13 . The method of  claim 1 , wherein the second information includes the first information.  
   
   
       14 . A system for communicating semiconductor manufacturing information, comprising: 
 an information handling system (“IHS”) associated with a first service provider for: 
 from a second service provider, receiving first information associated with processing of a lot of semiconductor components, the lot having been provided by the first service provider to the second service provider for the processing;  
 generating second information responsive to the first information; and  
 to a customer affiliated with the second service provider, outputting the second information.  
   
   
   
       15 . The system of  claim 14 , wherein the first service provider provides a virtual work order to the second service provider in association with providing the lot of semiconductor components to the second service provider.  
   
   
       16 . The system of  claim 14 , wherein the first service provider and the second service provider are separate business organizations.  
   
   
       17 . The system of  claim 14 , wherein the first information includes work-in-process (“WIP”) information.  
   
   
       18 . The system of  claim 17 , wherein the IHS is for receiving the WIP information by receiving the WIP information periodically, in response to passage of a predetermined period of time.  
   
   
       19 . The system of  claim 14 , wherein the first information includes shipping information.  
   
   
       20 . The system of  claim 14 , wherein the first information includes yield information.  
   
   
       21 . The system of  claim 14 , wherein the IHS is for receiving the first information and outputting the second information by receiving and outputting through a network.  
   
   
       22 . The system of  claim 21 , wherein the network is a global computer network.  
   
   
       23 . The system of  claim 21 , wherein the IHS is for receiving the first information and outputting the second information by receiving and outputting using the file transfer protocol (“FTP”).  
   
   
       24 . The system of  claim 21 , wherein the IHS is for receiving the first information and outputting the second information by receiving and outputting using the hyper text transfer protocol (“HTTP”).  
   
   
       25 . The system of  claim 14 , wherein the lot of semiconductor components is a lot of integrated chips (“IC's”).  
   
   
       26 . The system of  claim 14 , wherein the second information includes the first information.