Pick and place machine with improved component placement inspection

Abstract

Embodiments of the present invention improve upon component level inspection performed by pick and place machines. Such improvements include using a position sensitive device that measures the position of the placement head relative to the workpiece as the placement head travels towards and away from the workpiece during a placement cycle. The output of this sensor is used to selectably trigger the acquisition of the images used to measure a placement characteristic of the component placement machine.

1 . An image acquisition system for use in a pick and place machine, the system comprising: 
 an imaging device for acquiring an image of an intended placement location of a component on a workpiece;    a position sensitive device disposed to provide an output indicative of a position of a placement head in the pick and place machine; and    wherein image device acquisition timing is determined by the output of the position sensitive device.    
   
   
       2 . The system of  claim 1 , wherein the position sensing device is a linear encoder.  
   
   
       3 . The system of  claim 1 , wherein the position sensing device is a rotary encoder.  
   
   
       4 . The system of  claim 3 , wherein the rotary encoder is a semi-circle shape.