Dissipation Heat Pipe Structure and Manufacturing Method Thereof

Abstract

This invention discloses a manufacturing method and the structure for a dissipation heat pipe. The dissipation heat pipe includes a hollow closed pipe, a column, a type of fluid and a wick structure. The dissipation heat pipe is often used in conducting the heat from the chip. The dissipation heat pipe can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can coat on the metal surface and also can be mixed into the metal.

1 . A dissipation heat pipe structure, applied in conducting and dissipating a heat source generated by a chip, comprising: 
 a hollow closed pipe having a heat source end for contacting said heat source and a heat dissipation end which being corresponded to said heat source end for contacting a heat dissipation device, a temperature of said heat dissipation device being lower than said heat source;    a column having a first end for contacting said heat source end of said hollow closed pipe and a second end for contacting said heat dissipation end of said hollow closed end;    a type of fluid, set at said heat source end within said hollow closed pipe, after said heat source being contacted to said heat source end to vaporize said type of fluid to be a vapor, said vapor being then contacted to said heat dissipation end to form said type of fluid; and    a wick structure, set at an interior wall of said hollow closed pipe and a surface of said column for conducting said type of fluid to said heat source end from said heat dissipation end.    
   
   
       2 . The dissipation heat pipe structure of  claim 1 , wherein said heat source generated by said chip is conducted by a heat dissipation slip to said heat source end.  
   
   
       3 . The dissipation heat pipe structure of  claim 1 , wherein said hollow closed pipe is any long column.  
   
   
       4 . The dissipation heat pipe structure of  claim 1 , wherein said hollow closed pipe is any flat column.  
   
   
       5 . The dissipation heat pipe structure of  claim 1 , wherein said column is any long column.  
   
   
       6 . The dissipation heat pipe structure of  claim 1 , wherein said column is any flat column.  
   
   
       7 . The dissipation heat pipe structure of  claim 1 , wherein said heat dissipation device is composed of a plurality of heat sink fins.  
   
   
       8 . The dissipation heat pipe structure of  claim 1 , wherein said column is combined a metal with a bracket structure of carbon element to form a heat conduction material.  
   
   
       9 . The dissipation heat pipe structure of  claim 8 , wherein said metal is copper.  
   
   
       10 . The dissipation heat pipe structure of  claim 8 , wherein said metal is aluminum.  
   
   
       11 . The dissipation heat pipe structure of  claim 8 , wherein said metal is silver.  
   
   
       12 . The dissipation heat pipe structure of  claim 8 , wherein said metal is a metal material with high thermal conductivity.  
   
   
       13 . The dissipation heat pipe structure of  claim 8 , wherein said bracket structure of carbon element is a diamond.  
   
   
       14 . The dissipation heat pipe structure of  claim 8 , wherein said heat conduction material can be formed by chemical vapor deposition (CVD).  
   
   
       15 . The dissipation heat pipe structure of  claim 8 , wherein said heat conduction material can be formed by physical vapor deposition (PVD).  
   
   
       16 . The dissipation heat pipe structure of  claim 8 , wherein said heat conduction material can be formed by melting.  
   
   
       17 . The dissipation heat pipe structure of  claim 8 , wherein said heat conduction material can be formed by electroplating.  
   
   
       18 . A method for manufacturing a dissipation heat pipe structure, applied in conducting and dissipating a heat source generated by a chip, comprising: 
 employing a manufacturing to form a heat conduction material having a metal and a bracket structure of carbon element;    employing a die to form a hollow closed pipe and a column;    forming a wick structure in an interior wall of said hollow closed pipe and onto a surface of said column;    forming a type of fluid, set at an end within said hollow closed pipe; and    sealing said hollow closed pipe.    
   
   
       19 . The method for manufacturing a dissipation heat pipe structure of  claim 18 , further comprising providing copper to be said metal.  
   
   
       20 . The method for manufacturing a dissipation heat pipe structure of  claim 18 , further comprising providing aluminum to be said metal.  
   
   
       21 . The method for manufacturing a dissipation heat pipe structure of  claim 18 , further comprising providing silver to be said metal.  
   
   
       22 . The method for manufacturing a dissipation heat pipe structure of  claim 18 , further comprising providing a metal material having high thermal conductivity to be said metal.  
   
   
       23 . The method for manufacturing a dissipation heat pipe structure of  claim 18 , further comprising providing diamonds to be said bracket structure of carbon element.  
   
   
       24 . The method for manufacturing a dissipation heat pipe structure of  claim 18 , further comprising providing CVD to form said heat conduction material.