Assignee
HWANG MING-HANG
0 granted patents·9 pending applications·0 citations·filing 2006–2006
Top patents by PatentIndex Score
9 records- 0145US2007199682A1Dissipation Heat Pipe Structure and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 0243US2007199681A1Dissipation Heat Pipe Structure and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 0333US2007201203A1Adhesion Material Structure and Process Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 0433US2007199678A1Surface Coating Film Structure on Heat Dissipation Metal and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 0533US2006255451A1Heat Conduction Interface Method and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 0630US2007199677A1Heat Sink Fin Structure and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 0730US2007199679A1Chip Heat Dissipation System and Manufacturing Method and Structure of Heat Dissipation Device ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 0830US2007201207A1Chip Heat Dissipation System and Structure of Heat Exchange Device and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
- 0928US2006256528A1Air Blown Chip Dissipation Device and Manufacturing Method ThereofHWANG MING-HANG·Filed 2006·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →