Wafer-transferring pod capable of monitoring processing environment

Abstract

A wafer-transferring pod capable of monitoring process environment comprises a body and a sampling mechanism positioned on a top surface, a back surface or one of two side surfaces of the body for adsorbing contamination. The sampling mechanism comprises an inner chamber filled with adsorbent such as glass wool and a plurality of openings positioned on sidewalls of the inner chamber. In addition, the sampling mechanism may comprise a movable door and an opening for a user to absorb the air from the body without opening a front cover of the wafer-transferring pod. Further, the sampling mechanism may comprise an inner member positioned on the body and an outer member buckled into the inner member, wherein the inner member and the outer member have an opening through which the user can absorb the air in the body without opening the front cover of the wafer-transferring pod.

1 . A wafer-transferring pod, comprising: 
 a body configured to receive a plurality of wafers; and    a sampling mechanism positioned on the body for adsorbing contaminations from an interior of the body.    
   
   
       2 . The wafer-transferring pod of  claim 1 , wherein the body has a back surface, and the sampling mechanism is positioned on the back surface.  
   
   
       3 . The wafer-transferring pod of  claim 1 , wherein the body has two side surfaces, and the sampling mechanism is positioned on one of the two side surfaces.  
   
   
       4 . The wafer-transferring pod of  claim 1 , wherein the body has a top surface, and the sampling mechanism is positioned on the top surface.  
   
   
       5 . The wafer-transferring pod of  claim 1 , wherein the sampling mechanism includes a chamber having adsorbents therein.  
   
   
       6 . The wafer-transferring pod of  claim 5 , wherein the adsorbents include glass wool.  
   
   
       7 . The wafer-transferring pod of  claim 5 , wherein the chamber includes a plurality of openings, and the interior of the body communicates with that of the chamber via the openings.  
   
   
       8 . A wafer-transferring pod, comprising: 
 a body configured to receive a plurality of wafers; and    a sampling mechanism positioned on the body for a user to adsorb air from an interior of the body.    
   
   
       9 . The wafer-transferring pod of  claim 8 , wherein the body has a back surface, and the sampling mechanism is positioned on the back surface.  
   
   
       10 . The wafer-transferring pod of  claim 8 , wherein the body has two side surfaces, and the sampling mechanism is positioned on one of the two side surfaces.  
   
   
       11 . The wafer-transferring pod of  claim 8 , wherein the body has a top surface, and the sampling mechanism is positioned on the top surface.  
   
   
       12 . The wafer-transferring pod of  claim 8 , wherein the sampling mechanism includes a movable door.  
   
   
       13 . The wafer-transferring pod of  claim 12 , wherein the movable door is made of polyetherimide.  
   
   
       14 . The wafer-transferring pod of  claim 8 , wherein the sampling mechanism is an opening.  
   
   
       15 . The wafer-transferring pod of  claim 8 , wherein the sampling mechanism includes: 
 an inner member positioned on the body; and    an outer member configured to engage with the inner member;    wherein the inner member and the outer member have an opening through which the user can absorb the air from the body.    
   
   
       16 . The wafer-transferring pod of  claim 15 , wherein the sampling mechanism further includes adsorbent sheet positioned between the inner member and the outer member.  
   
   
       17 . The wafer-transferring pod of  claim 16 , wherein the adsorbent sheet is made of glass wool.  
   
   
       18 . The wafer-transferring pod of  claim 15 , wherein the sampling mechanism further includes a plug for sealing up the opening.