Substrate processing method and apparatus thereof

Abstract

A substrate processing method for performing development on an exposed resist on a processing target substrate, and an apparatus thereof. A developing solution is supplied to the processing target substrate to fill the solution on the processing target substrate to cause development of the exposed resist on the processing target substrate. The rinse solution is supplied onto a processing surface of the processing target substrate while rotating the processing target substrate, and the rinse solution is supplied onto the backside of the processing target substrate while rotating the processing target substrate.

1 . A substrate processing method for performing development on an exposed resist on a processing target substrate, comprising: 
 supplying a developing solution to the processing target substrate to fill the solution on the processing target substrate with the processing target substrate being at rest;    causing the development of the exposed resist on the processing target substrate to proceed with the processing target substrate being at rest, while moving upward a surrounding member that surrounds the processing target substrate;    moving the processing target substrate downward without supplying a rinse solution to the processing target substrate;    supplying the rinse solution onto a processing surface of the processing target substrate while rotating the processing target substrate;    supplying the rinse solution onto the backside of the processing target substrate while rotating the processing target substrate; and    moving downward the surrounding member that surrounds the processing target substrate.    
   
   
       2 . A substrate processing method for performing development on an exposed resist on a processing target substrate, comprising: 
 supplying a developing solution to the processing target substrate held by a support mechanism to fill the solution on the processing target substrate;    moving upward a surrounding member that surrounds the processing target substrate;    causing the development of the exposed resist on the processing target substrate to proceed with the processing target substrate being at rest;    shifting the processing target substrate from the support mechanism to a hold mechanism without supplying a rinse solution to the processing target substrate;    supplying the rinse solution to the processing target substrate while rotating the processing target substrate by the hold mechanism;    drying the processing target substrate while rotating the processing target substrate; and    shifting the processing target substrate from the hold mechanism to the support mechanism without supplying the rinse solution to the processing target substrate after drying the processing target substrate, and moving downward the surrounding member that surrounds the processing target substrate.    
   
   
       3 . A substrate processing method for performing development on an exposed resist on a processing target substrate, comprising: 
 supplying a developing solution to the processing target substrate held by a support mechanism to fill the solution on the processing target substrate;    moving upward a surrounding member that surrounds the processing target substrate;    causing the development of the exposed resist on the processing target substrate to proceed with the processing target substrate being at rest;    shifting the processing target substrate from the support mechanism to a hold mechanism without supplying a rinse solution to the processing target substrate;    supplying the rinse solution to the processing target substrate while rotating the processing target substrate by the hold mechanism;    drying the processing target substrate while rotating the processing target substrate;    shifting the processing target substrate from the hold mechanism to the support mechanism without supplying the rinse solution to the processing target substrate after drying the processing target substrate, and moving downward the surrounding member that surrounds the processing target substrate; and    carrying the processing target substrate from the support mechanism to a carrying mechanism outside an apparatus.    
   
   
       4 . The substrate processing method according to  claim 1 , wherein the rinse solution is pure water.  
   
   
       5 . The substrate processing method according to  claim 2 , wherein the development of the exposed resist on the processing target substrate substantially proceeds with the processing target substrate held by the support mechanism.  
   
   
       6 . The substrate processing method according to  claim 2 , wherein air is exhausted from only the inside of the surrounding member, from only around the surrounding member, or from both the inside of the surrounding member and around the surrounding member.  
   
   
       7 . The substrate processing method according to  claim 2 , wherein air is exhausted from both the inside of the surrounding member and around the surrounding member when the surrounding member is moved upward, while being exhausted from only the inside of the surrounding member when the surrounding member is moved downward.  
   
   
       8 . The substrate processing method according to  claim 2 , wherein a processing liquid is removed from the inside of the surrounding member and near the surrounding member substantially at the same time.  
   
   
       9 . The substrate processing method according to  claim 6 , wherein the air is exhausted substantially at a predetermined exhaust amount from only the inside of the surrounding member, or from both the inside of the surrounding member and around the surrounding member.  
   
   
       10 . The substrate processing method according to  claim 1 , wherein the developing solution supplied to the processing target substrate is also supplied to the surrounding member that surrounds the processing target substrate.  
   
   
       11 . The substrate processing method according to  claim 2 , wherein a second surrounding member in the shape of a circle or a rectangle that surrounds the surrounding member is provided around the surrounding member.  
   
   
       12 . A substrate manufacturing method for manufacturing a substrate using the substrate processing method according to  claim 1 .  
   
   
       13 . A substrate processing apparatus having a control mechanism that implements the substrate processing method according to  claim 1 .  
   
   
       14 . A substrate processing apparatus provided with a processing section that performs development on an exposed resist on a processing target substrate, comprising: 
 a support mechanism configured to enable the processing target substrate to be delivered and received to/from a carrying mechanism outside a processing chamber;    a hold mechanism configured to enable the processing target substrate to be delivered and received to/from the support mechanism, while further enabling the processing target substrate to be rotated;    a developing solution supply mechanism that supplies a developing solution to the processing target substrate held by the support mechanism;    a rinse solution supply mechanism that supplies a rinse solution to the processing target substrate held by the hold mechanism; and    a control mechanism which moves upward a surrounding member that surrounds the processing target substrate after the developing solution supply mechanism supplies the developing solution to the processing target substrate held by the support mechanism to fill the solution on the processing target substrate, then moves the surrounding member that surrounds the processing target substrate after the processing target substrate is shifted from the hold mechanism to the support mechanism, and/or the rinse solution supplied to the processing target substrate is dried, and thus controls movement of the surrounding member that surrounds the processing target substrate.    
   
   
       15 . A substrate processing apparatus provided with a processing section that performs development on an exposed resist on a processing target substrate, comprising: 
 a support mechanism configured to enable the processing target substrate to be delivered and received to/from a carrying mechanism outside a processing chamber;    a hold mechanism configured to receive the processing target substrate by the support mechanism moving downward, while enabling the processing target substrate to be rotated;    a surrounding member that surrounds the processing target substrate held by the support mechanism or the hold mechanism;    a developing solution supply mechanism that supplies a developing solution to the processing target substrate held by the support mechanism;    a moving mechanism that moves the surrounding member upward after the developing solution supply mechanism supplies the developing solution to the processing target substrate; and    a rinse solution supply mechanism that supplies a rinse solution to the processing target substrate held by the hold mechanism.    
   
   
       16 . A substrate processing apparatus provided with a processing section that performs development on an exposed resist on a processing target substrate, comprising: 
 a support mechanism configured to enable the processing target substrate to be delivered and received to/from a carrying mechanism outside a processing chamber;    a hold mechanism configured to receive the processing target substrate by the support mechanism moving downward, while enabling the processing target substrate to be rotated;    a surrounding member that surrounds the processing target substrate held by the support mechanism or the hold mechanism;    a developing solution supply mechanism that supplies a developing solution to the processing target substrate held by the support mechanism;    a rinse solution supply mechanism that supplies a rinse solution to the processing target substrate held by the hold mechanism; and    a moving mechanism configured to move the surrounding member upward after the developing solution supply mechanism supplies the developing solution to the processing target substrate, while moving the surrounding member downward after the rinse solution supplies the rinse solution to the processing target substrate held by the hold mechanism.    
   
   
       17 . The substrate processing apparatus according to  claim 15 , wherein air is exhausted from only the inside of the surrounding member when the surrounding member is moved downward, while being exhausted from both the inside of the surrounding member and around the surrounding member when the surrounding member is moved downward.  
   
   
       18 . The substrate processing apparatus according to  claim 15 , wherein the developing solution from the developing solution supply mechanism is also supplied the surrounding member when the developing solution supply mechanism supplies the developing solution to the processing target substrate held by the support mechanism.  
   
   
       19 . The substrate processing apparatus according to  claim 15 , wherein a second surrounding member that surrounds the surrounding member is further provided around the surrounding member.  
   
   
       20 . A substrate processing method that processes a substrate sequentially using the substrate processing apparatus according to  claim 14.