Structure and self-locating method of making capped chips

Abstract

A capped chip is provided in which a cap member has a bottom surface facing a front surface of the chip and a top surface opposite the front surface. A plurality of through holes is desirably provided in the cap member which extend from the bottom surface to the top surface. A plurality of metallic interconnects electrically connected to the chip are provided which project upwardly from the front surface of the chip at least partially through the through holes. Desirably, the metallic interconnects include stud bumps.

1 . A capped chip, comprising: 
 a chip having a front surface;    a cap member having a bottom surface facing said front surface of said chip and having a top surface opposite said front surface, said cap member further having a plurality of through holes extending from said bottom surface to said top surface; and    a plurality of metallic interconnects including stud bumps electrically connected to said chip and projecting upwardly from said front surface at least partially through said through holes.    
     
     
         2 . A capped chip as claimed in  claim 1  wherein said chip has bond pads exposed at said front surface and said stud bumps are joined to said bond pads and electrically connected to said chip through said bond pads.  
     
     
         3 . A capped chip as claimed in  claim 1 , wherein said stud bumps extend at least to said top surface.  
     
     
         4 . A capped chip as claimed in  claim 3 , wherein said metallic interconnects include annular solderable metallizations surrounding said through holes on said top surface of said cap member, said capped chip further comprising solder masses joining said solderable metallizations to said stud bumps.  
     
     
         5 . A capped chip as claimed in  claim 1 , wherein said stud bumps are sealed to said cap member.  
     
     
         6 . A capped chip as claimed in  claim 5 , wherein said through holes do not have solderable metallizations.  
     
     
         7 . A capped chip as claimed in  claim 6 , wherein said stud bumps are sealed by a conductive organic material.  
     
     
         8 . A capped chip as claimed in  claim 6 , wherein said stud bumps are sealed by a nonconductive material and said stud bumps protrude through said nonconductive material.  
     
     
         9 . A capped chip as claimed in  claim 8 , wherein said nonconductive material is organic.  
     
     
         10 . A capped chip as claimed in  claim 9 , further comprising masses of an electrically conductive bonding material joined to said stud bumps at positions external to said top surface.  
     
     
         11 . An assembly including a capped chip as claimed in  claim 8 , and further comprising an interconnection element, said interconnection element including pressure contacts pressed against said stud bumps to electrically interconnect said interconnection element to said capped chip.  
     
     
         12 . A capped chip as claimed in  claim 8 , wherein said metallic interconnects are coplanar with said top surface.  
     
     
         13 . A capped chip as claimed in  claim 8 , wherein said stud bumps are sealed to said through holes by said nonconductive material.  
     
     
         14 . A capped chip as claimed in  claim 1 , wherein sidewalls of said through holes are oriented at an angle of about 90 degrees to said top surface.  
     
     
         15 . A capped chip as claimed in  claim 1 , wherein said through holes are tapered, becoming smaller in a direction from said bottom surface towards a midpoint of a thickness of said cap member and, becoming smaller in a direction from said top surface towards said midpoint of said thickness.  
     
     
         16 . A capped chip as claimed in  claim 1 , wherein said through holes are tapered, becoming smaller in a direction from said bottom surface towards said top surface.  
     
     
         17 . A capped chip as claimed in  claim 1 , wherein said through holes are tapered, becoming smaller in a direction from said top surface towards said bottom surface.  
     
     
         18 . A capped chip as claimed in  claim 16 , wherein a sealing material is disposed between said bottom surface of said cap member and a portion of said front surface of said chip.  
     
     
         19 . An assembly including a capped chip as claimed in  claim 16 , further comprising a circuit panel having a plurality of terminals, wherein said metallic interconnects are joined to said terminals of said circuit panel.  
     
     
         20 . A capped chip as claimed in  claim 1 , wherein said stud bumps include at least one metal selected from the group consisting of aluminum, gold, silver, platinum, and copper.