Bonding pad structure and method of forming the same

Abstract

A bonding pad structure and fabrication method thereof. A bonding pad is substantially surrounded and insulated by a dielectric layer, wherein the bonding pad is formed of at least one first conductive layer having a wiring layer with a stripe layout and a first edge portion, a second conductive layer having a wire bonding portion and a second edge portion and a plurality of plugs electrically connecting the wiring layer and the wire bonding portion. A conductive structure of an array of metal plugs or a metal damascene structure is formed to connect the first edge portion and the second edge portion, thereby preventing burn out of the first edge portion during an ESD event.

1 . A method of forming a bonding pad structure, comprising the steps of: 
 providing a bonding pad substantially surrounded and insulated by a dielectric layer, wherein the bonding pad is formed of at least one first conductive layer having a wiring layer with a stripe layout and a first edge portion, a second conductive layer having a wire bonding portion and a second edge portion and a plurality of plugs electrically connecting the wiring layer and the wire bonding portion; and    forming a conductive structure to connect the first edge portion and the second edge portion, thereby preventing burn out of the first edge portion during an ESD event.    
     
     
         2 . The method according to  claim 1 , further comprising the step of: 
 forming an electrostatic discharge (ESD) protection device electrically connected to the first conductive layer.    
     
     
         3 . The method according to  claim 1 , wherein a material of the dielectric layer is a low dielectric constant material.  
     
     
         4 . The method according to  claim 1 , wherein the first and second conductive layers are metal layers.  
     
     
         5 . The method according to  claim 1 , wherein the conductive structure is an array of metal plugs.  
     
     
         6 . The method according to  claim 1 , wherein the conductive structure is a metal damascene structure.  
     
     
         7 . A method of forming a bonding pad structure, comprising the steps of: 
 providing a substrate having an interlevel dielectric (ILD) layer thereon, forming a bonding pad on the ILD layer;    forming an intermetal dielectric (IMD) layer to surround and insulate the bonding pad, wherein the bonding pad is formed of at least one metal layer having a wiring layer with a stripe layout and a first edge portion, a bonding metal layer having a wire bonding portion and a second edge portion and a plurality of plugs electrically connecting the wiring layer and the wire bonding portion; and    forming a conductive structure to connect the first edge portion and the second edge portion, thereby preventing burn out of the first edge portion during an ESD event.    
     
     
         8 . The method according to  claim 7 , further comprising the step of: 
 an electrostatic discharge (ESD) protection device electrically connected to the first conductive layer.    
     
     
         9 . The method according to  claim 7 , wherein a material of the IMD layer is a low dielectric constant material.  
     
     
         10 . The method according to  claim 7 , wherein the conductive structure is an array of metal plugs.  
     
     
         11 . The method according to  claim 7 , wherein the conductive structure is a metal damascene structure.