Slurry residence time enhancement system

Abstract

A slurry residence time enhancement system for a chemical mechanical polishing apparatus having a base, a platen on the base, a polishing pad on the platen and a polishing head over the polishing pad is disclosed. The system includes at least one slurry distribution unit having a slurry distribution member for positioning on the polishing pad. In operation of the CMP apparatus, the slurry distribution member redirects polishing slurry on the polishing pad to the polishing head. The system may alternatively or additionally include a rim for upward extension from the base and a seal for insertion between the platen and the polishing pad adjacent to the rim.

1 . A slurry residence time enhancement system for a chemical mechanical polishing apparatus having a base, a platen on the base, a polishing pad on the platen and a polishing head over the polishing pad, comprising: 
 at least one slurry distribution unit having a slurry distribution member for positioning on said polishing pad and redirecting polishing slurry on said polishing pad to said polishing heads;    wherein said slurry distribution member comprises a generally semicircular configuration with a concave side, said concave side oriented against a direction of rotation of said polishing pad.    
   
   
       2 . The slurry residence time enhancement system of  claim 1  wherein said at least one slurry distribution unit comprises a pair of slurry distribution units.  
   
   
       3 . (canceled)  
   
   
       4 . The slurry residence time enhancement system of  claim 1  wherein said slurry distribution member corresponds to a curvature of a circle having a diameter of about 12 inches.  
   
   
       5 . The slurry residence time enhancement system of  claim 1  wherein said slurry distribution member comprises an upper segment and a lower segment carried by said upper segment.  
   
   
       6 . The slurry residence time enhancement system of  claim 5  wherein said lower segment has tapered ends.  
   
   
       7 . The slurry residence time enhancement system of  claim 1  wherein said at least one slurry distribution unit comprises a base and a support arm carried by said base, and wherein said slurry distribution member is carried by said support arm.  
   
   
       8 . The slurry residence time enhancement system of  claim 7  wherein said slurry distribution member comprises a generally semicircular upper segment carried by said support arm and a generally semicircular lower segment carried by said upper segment.  
   
   
       9 . A slurry residence time enhancement system for a chemical mechanical polishing apparatus having a base, a platen on the base, a polishing pad on the platen and a polishing head over the polishing pad, comprising: 
 a slurry distribution member comprising a generally semicircular configuration with a concave side, said concave side oriented against a direction of rotation of said platen and said polishing pad;    a rim extending upward from the base around the circumference of the base; and    a seal between the platen and the polishing pad adjacent to said rim.    
   
   
       10 . The slurry residence time enhancement system of  claim 9  wherein said rim has a height of at least about 6 mm.  
   
   
       11 . The slurry residence time enhancement system of  claim 9  wherein said seal has a width of at least about 0.5 mm.  
   
   
       12 . The slurry residence time enhancement system of  claim 9  wherein said rim is offset with respect to said base.  
   
   
       13 . A slurry residence time enhancement system for a chemical mechanical polishing apparatus having a base, a platen on the base, a polishing pad on the platen and a polishing head over the polishing pad, comprising: 
 at least one slurry distribution unit having a slurry distribution member for positioning on the polishing pad and redirecting polishing slurry on the polishing pad to the polishing head;    a slurry delivery arm positioned over said polishing pad for dispensing slurry on said polishing pad;    a rim extending upward from the base around the circumference of the base; and    a seal for insertion between the platen and the polishing pad adjacent to said rim;    wherein said slurry distribution member comprises a generally semicircular configuration with a concave side, said concave side oriented against a direction of rotation of said polishing pad and positioned in said direction of rotation between said slurry delivery arm and said polishing head.    
   
   
       14 . The slurry residence time enhancement system of  claim 13  wherein said at least one slurry distribution unit comprises a pair of slurry distribution units.  
   
   
       15 . (canceled)  
   
   
       16 . The slurry residence time enhancement system of  claim 13  wherein said at least one slurry distribution unit comprises a base and a support arm carried by said base, and wherein said slurry distribution member is carried by said support arm.  
   
   
       17 . The slurry residence time enhancement system of  claim 13  wherein said slurry distribution member comprises a generally semicircular upper segment carried by said support arm and a generally semicircular lower segment carried by said upper segment.  
   
   
       18 . The slurry distribution time enhancement system of  claim 17  wherein said lower segment has tapered ends.  
   
   
       19 . The slurry residence time enhancement system of  claim 13  wherein said rim has a height of at least about 6 mm.  
   
   
       20 . The slurry residence time enhancement system of  claim 13  wherein said seal has a width of at least about 0.5 mm.  
   
   
       21 . The slurry residence time enhancement system of  claim 1 , further comprising a slurry delivery arm positioned over said polishing pad for dispensing said slurry on said polishing pad wherein said at least one slurry distribution unit is positioned between said slurry delivery arm and said polishing head in said direction of rotation.  
   
   
       22 . The slurry residence time enhancement system of  claim 1 , wherein said slurry distribution member is positioned adjacent an said polishing pad edge to intercept and redirect said slurry from said polishing pad edge toward said polishing head.