Electroplating composition and method

Abstract

Electroplating composition and method. In one embodiment, the composition comprises an electrolyte solution and an amine-based copolymer comprising monomer units of ethylene oxide and propylene oxide, with the propylene oxide present in a quantity of at least about 70 wt %. The method comprises electroplating a metal onto a substrate from the electroplating composition of the invention.

1 . An electroplating composition, comprising: 
 an electrolyte solution; and    an amine-based copolymer comprising monomer units of ethylene oxide and propylene oxide in the electrolyte solution, wherein the propylene oxide is present in the copolymer in a quantity of at least about 70 wt %.    
   
   
       2 . The electroplating composition of  claim 1 , wherein the propylene oxide is present in the copolymer in a quantity of about 80-95 wt %.  
   
   
       3 . The electroplating composition of  claim 1 , wherein the amine-based copolymer has a cloud point temperature of above 80° C. in 0.1% acid solution.  
   
   
       4 . The electroplating composition of  claim 1 , wherein the amine-based copolymer comprises a core of alkylene diamine.  
   
   
       5 . The electroplating composition of  claim 4 , wherein the amine-based copolymer comprises an ethylene oxide-propylene oxide (EO-PO) copolymer of ethylene diamine.  
   
   
       6 . The electroplating composition of  claim 1 , wherein the amine-based copolymer comprises terminal alkyl amine.  
   
   
       7 . The electroplating composition of  claim 6 , wherein the amine-based copolymer comprises an ethylene oxide-propylene oxide (EO-PO) copolymer of lauryl amine or tallow amine.  
   
   
       8 . The electroplating composition of  claim 1 , wherein the amine-based copolymer has a weight average molecular weight (Mw) of about 2,000-20,000.  
   
   
       9 . The electroplating composition of  claim 1 , wherein the amine-based copolymer is a block copolymer.  
   
   
       10 . The electroplating composition of  claim 1 , wherein the amine-based copolymer is a random copolymer.  
   
   
       11 . The electroplating composition of  claim 1 , wherein the amine-based copolymer is an alternating copolymer.  
   
   
       12 . The electroplating composition of  claim 1 , wherein the amine-based copolymer is present in the electrolyte solution in a concentration of about 100-300 ppm.  
   
   
       13 . An electroplating composition, comprising: 
 an electrolyte solution;    an amine-based copolymer comprising monomer units of ethylene oxide and propylene oxide in the electrolyte solution as a first suppressor additive, wherein the propylene oxide is present in the amine-based copolymer in a quantity of at least about 70 wt %; and    a copolymer comprising monomer units of ethylene oxide and propylene oxide in the electrolyte solution as a second suppressor additive, wherein the ethylene oxide is present in the copolymer in a quantity of at least about 60 wt %.    
   
   
       14 . The electroplating composition of  claim 13 , wherein the first and second suppressor additives are present in the electrolyte solution in concentrations of about 100-300 ppm and 50-100 ppm, respectively.  
   
   
       15 . The electroplating composition of  claim 13 , wherein the second suppressor is a random copolymer.  
   
   
       16 . The electroplating composition of  claim 13 , wherein the second suppressor is a block copolymer.  
   
   
       17 . The electroplating composition of  claim 13 , wherein the second suppressor is an alternating copolymer.  
   
   
       18 . The electroplating composition of  claim 13 , wherein the amine-based copolymer comprises terminal alkyl amine.  
   
   
       19 . A method of electroplating a metal on a substrate, comprising: 
 providing an electroplating bath comprising the electroplating composition of  claim 1;     immersing the substrate in the electroplating bath; and    electroplating the metal onto the substrate from the electroplating composition of  claim 1 .    
   
   
       20 . The method of  claim 19 , wherein the electroplating composition further comprises an ethylene oxide-propylene oxide (EO-PO) copolymer, wherein the ethylene oxide is present in the copolymer in a quantity of at least about 60 wt %.  
   
   
       21 . The method of  claim 19 , wherein the substrate is a semiconductor wafer substrate.