Substrate for semiconductor devices and semiconductor device

Abstract

The present invention provides to a substrate for a semiconductor device, in which electric characteristics to high-speed signals are enhanced by facilitating the mounting of a circuit component, such as a decoupling capacitor, fabricated separately from the substrate. The substrate ( 30 ) for a semiconductor device, on which the circuit component ( 50 ), such as a decoupling capacitor, can be mounted, is counterbored from the mounting surface side thereof, and a component mounting hole ( 32 ) where a connection terminal ( 23 a ), which will be electrically connected to the circuit component ( 50 ), is exposed in the inner bottom face is made by counterboring. The circuit componetnt ( 50 ) is mounted and electrically connected to the connection terminal ( 23 a ), and a semiconductor element ( 10 ) is mounted on the substrate by flip-chip connection.

1 . A substrate for a semiconductor device, on which a circuit component can be mounted, characterized in, 
 that a surface opposite to an element mounting surface is counterbored so as to form a component mounting hole where a connection terminal, which will be electrically connected to the circuit component, is exposed in the inner bottom face.    
     
     
         2 . The substrate according to  claim 1 , wherein the component mounting hole is located in a semiconductor element mounting area.  
     
     
         3 . The substrate according to  claim 2 , wherein the circuit component, which is electrically connected to the connection terminal, is mounted in the component mounting hole.  
     
     
         4 . A semiconductor device comprising: the substrate of  claim 3;  and a semiconductor element being mounted on the substrate by flip-chip connection.  
     
     
         5 . The substrate according to  claim 1 , wherein the substrate is constituted by a core plate and a cable layer or layers formed on the core plate, and 
 the surface of the substrate, which is opposite to the element mounting surface thereof, is counterbored so as to form a component mounting hole where a connection terminal, which is formed in the cable layer, is exposed in the inner bottom face.    
     
     
         6 . The substrate according to  claim 5 , wherein the component mounting hole is located in a semiconductor element mounting area.  
     
     
         7 . The substrate according to  claim 6 , wherein the circuit component, which is electrically connected to the connection terminal, is mounted in the component mounting hole.  
     
     
         8 . The substrate according to  claim 7 , wherein a decoupling capacitor is mounted as the circuit component.  
     
     
         9 . A semiconductor device comprising: the substrate of  claim 7;  and a semiconductor element being mounted on the substrate by flip-chip connection.  
     
     
         10 . A semiconductor device comprising: the substrate of  claim 8;  and a semiconductor element being mounted on the substrate by flip-chip connection.