Inventor · disambiguated record

Ryuji Komatsu

Also filed as: KOMATSU RYUJI

1 granted patent·1 pending application·6 citations·filing 2004–2006

30Inventor score

Technology areasH05K

Files withKOMATSU RYUJI1 NIHON MICRON CO LTD1

Top patents by PatentIndex Score

2 records

0158US7348213B2Method for forming component mounting hole in semiconductor substrateNIHON MICRON CO LTD·Filed 2006·Granted Mar 25, 2008·6 cites·7 claims
0223US2006138638A1Substrate for semiconductor devices and semiconductor deviceKOMATSU RYUJI·Filed 2004·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →